Fortier; Paul Francis
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fortier; Paul Francis.The latest application filed is for "high-bandwidth embedded optical connector with latching mechanism".
- Fortier; Paul Francis - Richelieu CA
- Fortier; Paul Francis - Quebec CA
| Patent | Date |
|---|---|
| High-bandwidth embedded optical connector with latching mechanism Grant 11,280,968 - Janta-Polczynski , et al. March 22, 2 | 2022-03-22 |
| Photonics package with face-to-face bonding Grant 11,209,598 - Janta-Polczynski , et al. December 28, 2 | 2021-12-28 |
| Pluggable LGA socket for high density interconnects Grant 11,146,003 - Benner , et al. October 12, 2 | 2021-10-12 |
| High-bandwidth Embedded Optical Connector With Latching Mechanism App 20210263236 - JANTA-POLCZYNSKI; BARNIM ALEXANDER ; et al. | 2021-08-26 |
| Photonics Package With Face-to-face Bonding App 20200279840 - JANTA-POLCZYNSKI; BARNIM ALEXANDER ; et al. | 2020-09-03 |
| Microlens array assembling process Grant 10,754,070 - Masuda , et al. A | 2020-08-25 |
| Optical device with adhesive connection of recess or side protrusion Grant 10,690,867 - Masuda , et al. | 2020-06-23 |
| Microlens Array Assembling Process App 20200183059 - Masuda; Koji ; et al. | 2020-06-11 |
| Nanofiller in an optical interface Grant 10,338,325 - Janta-Polczynski , et al. | 2019-07-02 |
| Optical interconnect attach to photonic device with partitioning adhesive function Grant 10,302,869 - Janta-Polczynski , et al. | 2019-05-28 |
| Optical interconnect attach to photonic device with partitioning adhesive function Grant 10,295,749 - Janta-Polczynski , et al. | 2019-05-21 |
| Pluggable Lga Socket For High Density Interconnects App 20180358725 - Benner; Alan F. ; et al. | 2018-12-13 |
| Pluggable LGA socket for high density interconnects Grant 10,128,590 - Benner , et al. November 13, 2 | 2018-11-13 |
| Connecting mid-board optical modules Grant 10,073,223 - Barwicz , et al. September 11, 2 | 2018-09-11 |
| Connecting Mid-board Optical Modules App 20180052285 - BARWICZ; Tymon ; et al. | 2018-02-22 |
| Connecting mid-board optical modules Grant 9,835,804 - Barwicz , et al. December 5, 2 | 2017-12-05 |
| Connecting mid-board optical modules Grant 9,720,188 - Barwicz , et al. August 1, 2 | 2017-08-01 |
| Connecting Mid-board Optical Modules App 20170199337 - BARWICZ; Tymon ; et al. | 2017-07-13 |
| Connecting mid-board electronic devices Grant 9,706,670 - Barwicz , et al. July 11, 2 | 2017-07-11 |
| Connecting Mid-board Optical Modules App 20170192181 - Barwicz; Tymon ; et al. | 2017-07-06 |
| Connecting Mid-board Electronic Devices App 20170196097 - BARWICZ; Tymon ; et al. | 2017-07-06 |
| Pluggable LGA socket for high density interconnects Grant 9,577,361 - Benner , et al. February 21, 2 | 2017-02-21 |
| Pluggable Lga Socket For High Density Interconnects App 20160118760 - Benner; Alan F. ; et al. | 2016-04-28 |
| Pluggable Lga Socket For High Density Interconnects App 20160118731 - Benner; Alan F. ; et al. | 2016-04-28 |
| Electronic module assembly with patterned adhesive array Grant 9,293,439 - Blackshear , et al. March 22, 2 | 2016-03-22 |
| Electronic module assembly with patterned adhesive array Grant 9,093,563 - Blackshear , et al. July 28, 2 | 2015-07-28 |
| Electronic Module Assembly With Patterned Adhesive Array App 20150093859 - Blackshear; Edmund ; et al. | 2015-04-02 |
| Electronic Module Assembly With Patterned Adhesive Array App 20150014836 - Blackshear; Edmund ; et al. | 2015-01-15 |
| Assembly of opto-electronic module with improved heat sink Grant 6,822,875 - Chan , et al. November 23, 2 | 2004-11-23 |
| Assembly of opto-electronic module with improved heat sink App 20030059176 - Chan, Benson ; et al. | 2003-03-27 |
| Assembly of opto-electronic module with improved heat sink Grant 6,508,595 - Chan , et al. January 21, 2 | 2003-01-21 |
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