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Patent applications and USPTO patent grants for Forthun; John A..The latest application filed is for "chip stack with differing chip package types".
Patent | Date |
---|---|
Stackable chip package with flex carrier Grant RE41,039 - Forthun December 15, 2 | 2009-12-15 |
Chip stack with differing chip package types Grant 6,908,792 - Bruce , et al. June 21, 2 | 2005-06-21 |
Method of assembling a stackable integrated circuit chip Grant 6,660,561 - Forthun , et al. December 9, 2 | 2003-12-09 |
Chip stack with differing chip package types Grant 6,627,984 - Bruce , et al. September 30, 2 | 2003-09-30 |
Chip stack with differing chip package types App 20030025211 - Bruce, Ted ;   et al. | 2003-02-06 |
Chip stack with differing chip package types App 20030020153 - Bruce, Ted ;   et al. | 2003-01-30 |
Mechanically registered and interconnected chip App 20020185724 - Forthun, John A. ;   et al. | 2002-12-12 |
Stackable chip package with flex carrier Grant 6,473,308 - Forthun October 29, 2 | 2002-10-29 |
Module with one side stacked memory App 20020089831 - Forthun, John A. | 2002-07-11 |
Stackable chip package with flex carrier App 20010015487 - Forthun, John A. | 2001-08-23 |
Stackable chip package with flex carrier Grant 6,262,895 - Forthun July 17, 2 | 2001-07-17 |
Chip stack and method of making same Grant 5,612,570 - Eide , et al. March 18, 1 | 1997-03-18 |
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