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Sidewall magnet improving uniformity of inductively coupled plasma and shields used therewith App 20040055880 - Gung, Tza-Jing ;   et al. | 2004-03-25 |
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Apparatus for filling apertures in a film layer on a semiconductor structure App 20020089027 - Xu, Zheng ;   et al. | 2002-07-11 |
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Method and apparatus for generating a plasma Grant 6,228,229 - Raaijmakers , et al. May 8, 2 | 2001-05-08 |
Filling narrow apertures and forming interconnects with a metal utilizing a crystallographically oriented liner layer Grant 6,217,721 - Xu , et al. April 17, 2 | 2001-04-17 |
Use of modulated inductive power and bias power to reduce overhang and improve bottom coverage Grant 6,193,855 - Gopalraja , et al. February 27, 2 | 2001-02-27 |
Semiconductor device having a low thermal budget metal filling and planarization of contacts, vias and trenches Grant 5,962,923 - Xu , et al. October 5, 1 | 1999-10-05 |
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Inductively coupled plasma reactor with top electrode for enhancing plasma ignition Grant 5,685,941 - Forster , et al. November 11, 1 | 1997-11-11 |