loadpatents
name:-0.0050921440124512
name:-0.0044608116149902
name:-0.0011899471282959
FORMOSA MICROSEMI CO., LTD. Patent Filings

FORMOSA MICROSEMI CO., LTD.

Patent Applications and Registrations

Patent applications and USPTO patent grants for FORMOSA MICROSEMI CO., LTD..The latest application filed is for "flip-chip packaging diode with a multichip structure".

Company Profile
0.5.7
  • FORMOSA MICROSEMI CO., LTD. - New Taipei City TW
  • FORMOSA MICROSEMI CO., Ltd. - New Taipei N/A TW
  • Formosa Microsemi Co., Ltd - New Taipei TW
  • Formosa Microsemi Co., Ltd. - TW TW
  • FORMOSA MICROSEMI CO., Ltd. - Taipei County TW
  • FORMOSA MICROSEMI CO., LTD. - TAIPEI HSIEN TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Flip-chip Packaging Diode With A Multichip Structure
App 20180166367 - WU; Wen-Hu ;   et al.
2018-06-14
Flip-chip LED component built therein with a zener chip
Grant 9,064,856 - Huang , et al. June 23, 2
2015-06-23
Well-through type diode element/component and manufacturing method for them
Grant 8,791,551 - Huang , et al. July 29, 2
2014-07-29
Constant current semiconductor device having a schottky barrier
Grant 8,742,533 - Tsai , et al. June 3, 2
2014-06-03
Well-through Type Diode Element/component And Manufacturing Method For Them
App 20130241056 - HUANG; Wen-Ping ;   et al.
2013-09-19
Flip Chip Type Full Wave Rectification Semiconductor Device And Its Manufacturing Method
App 20130075891 - HUANG; Wen-Ping ;   et al.
2013-03-28
Manufacturing method and structure of a surface-mounting type diode co-constructed from a silicon wafer and a base plate
Grant 8,404,565 - Huang , et al. March 26, 2
2013-03-26
Constant Current Semiconductor Device Having A Schottky Barrier
App 20130049160 - TSAI; Sheau-Feng ;   et al.
2013-02-28
Manufacturing method and structure of a surface-mounting type diode co-constructed from a silicon wafer and a base plate
App 20110272777 - Huang; Wen-Ping ;   et al.
2011-11-10
Heat sinking structure of power semiconductor
App 20050259400 - Huang, Wen-Ping
2005-11-24
Company Registrations

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed