loadpatents
name:-0.014795064926147
name:-0.012154817581177
name:-0.0031158924102783
Formosa; Kevin Patent Filings

Formosa; Kevin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Formosa; Kevin.The latest application filed is for "method of manufacturing electronic devices and corresponding electronic device".

Company Profile
3.10.11
  • Formosa; Kevin - Zabbar Zbr MT
  • FORMOSA; Kevin - Zabbar MT
  • Formosa; Kevin - Zabbar Malta MT
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Electronic device and corresponding manufacturing method
Grant 11,352,251 - Formosa , et al. June 7, 2
2022-06-07
Electronic Device And Corresponding Manufacturing Method
App 20200307991 - FORMOSA; Kevin ;   et al.
2020-10-01
Method Of Manufacturing Electronic Devices And Corresponding Electronic Device
App 20200307994 - FORMOSA; Kevin ;   et al.
2020-10-01
Package with chambers for dies and manufacturing process thereof
Grant 10,329,143 - Formosa
2019-06-25
Microelectromechanical microphone
Grant 10,225,635 - Brioschi , et al.
2019-03-05
Microelectromechanical Microphone
App 20170006368 - BRIOSCHI; Roberto ;   et al.
2017-01-05
Method Of Manufacturing Electronic Components And Corresponding Electronic Component
App 20160368098 - Fonk; Kenneth ;   et al.
2016-12-22
Wafer-level packaging of integrated devices, and manufacturing method thereof
Grant 9,446,943 - Formosa , et al. September 20, 2
2016-09-20
Method for soldering a cap to a support layer
Grant 9,390,988 - Azzopardi , et al. July 12, 2
2016-07-12
Package For A Mems Sensor And Manufacturing Process Thereof
App 20160107884 - Formosa; Kevin
2016-04-21
Surface mount package for a semiconductor integrated device, related assembly and manufacturing process
Grant 9,257,372 - Duca , et al. February 9, 2
2016-02-09
Package for a MEMS sensor and manufacturing process thereof
Grant 9,253,579 - Formosa February 2, 2
2016-02-02
Wafer-level Packaging Of Integrated Devices, And Manufacturing Method Thereof
App 20140353775 - Formosa; Kevin ;   et al.
2014-12-04
Microelectromechanical transducer and corresponding assembly process
Grant 8,837,754 - Formosa , et al. September 16, 2
2014-09-16
Surface Mount Package For A Semiconductor Integrated Device, Related Assembly And Manufacturing Process
App 20140091443 - Duca; Roseanne ;   et al.
2014-04-03
Method For Soldering A Cap To A Support Layer
App 20130083501 - Azzopardi; Mark A. ;   et al.
2013-04-04
Package For A Mems Sensor And Manufacturing Process Thereof
App 20130032936 - Formosa; Kevin
2013-02-07
Microelectromechanical Transducer And Corresponding Assembly Process
App 20120153771 - Formosa; Kevin ;   et al.
2012-06-21
Removable wafer expander for die bonding equipment
Grant 7,675,170 - Formosa March 9, 2
2010-03-09
Removable Wafer Expander For Die Bonding Equipment
App 20080032489 - Formosa; Kevin
2008-02-07

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