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Patent applications and USPTO patent grants for Form Factor, Inc..The latest application filed is for "method of testing semiconductor".
Patent | Date |
---|---|
Method of testing semiconductor Grant 5,998,228 - Eldridge , et al. December 7, 1 | 1999-12-07 |
Method and apparatus for applying a layer of flowable coating material to a surface of an electronic component Grant 5,912,046 - Eldridge , et al. June 15, 1 | 1999-06-15 |
Mounting spring elements on semiconductor devices Grant 5,884,398 - Eldridge , et al. March 23, 1 | 1999-03-23 |
Method of making contact tip structures Grant 5,864,946 - Eldridge , et al. February 2, 1 | 1999-02-02 |
Method of making raised contacts on electronic components Grant 5,852,871 - Khandros December 29, 1 | 1998-12-29 |
Method of making temporary connections between electronic components Grant 5,832,601 - Eldridge , et al. November 10, 1 | 1998-11-10 |
Solder preforms Grant 5,820,014 - Dozier, II , et al. October 13, 1 | 1998-10-13 |
Sockets for electronic components and methods of connecting to electronic components Grant 5,772,451 - Dozier, II , et al. June 30, 1 | 1998-06-30 |
Method of manufacturing electrical contacts, using a sacrificial member Grant 5,476,211 - Khandros December 19, 1 | 1995-12-19 |
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