Foong; Sally
Patent Applications and Registrations
Patent applications and USPTO patent grants for Foong; Sally.The latest application filed is for "tape chip on lead using paste die attach material".
- Foong; Sally - Milpitas CA
| Patent | Date |
|---|---|
| Tape chip on lead using paste die attach material Grant 9,679,831 - Chin , et al. June 13, 2 | 2017-06-13 |
| Tape Chip On Lead Using Paste Die Attach Material App 20170047272 - CHIN; Lai Nguk ; et al. | 2017-02-16 |
| Method of chip positioning for multi-chip packaging Grant 9,196,608 - Foong , et al. November 24, 2 | 2015-11-24 |
| Chip Positioning In Multi-chip Package App 20150056726 - FOONG; Sally ; et al. | 2015-02-26 |
| Chip positioning in multi-chip package Grant 8,901,756 - Foong , et al. December 2, 2 | 2014-12-02 |
| Chip Positioning in Multi-Chip Package App 20140175613 - FOONG; Sally ; et al. | 2014-06-26 |
| Method and system for thin multi chip stack package with film on wire and copper wire Grant 8,680,686 - Chin , et al. March 25, 2 | 2014-03-25 |
| Stitch bump stacking design for overall package size reduction for multiple stack Grant 8,357,563 - Chin , et al. January 22, 2 | 2013-01-22 |
| Stitch Bump Stacking Design For Overall Package Size Reduction For Multiple Stack App 20120038059 - CHIN; Lai Nguk ; et al. | 2012-02-16 |
| Method And System For Thin Multi Chip Stack Package With Film On Wire And Copper Wire App 20110316158 - CHIN; Lai Nguk ; et al. | 2011-12-29 |
| Reduction of package height in a stacked die configuration Grant 7,932,131 - Foong , et al. April 26, 2 | 2011-04-26 |
| Process applying die attach film to singulated die Grant 7,799,612 - Foong , et al. September 21, 2 | 2010-09-21 |
| Die offset die to die bonding Grant 7,750,481 - Lai , et al. July 6, 2 | 2010-07-06 |
| Die offset die to bonding Grant 7,674,653 - Lai , et al. March 9, 2 | 2010-03-09 |
| Die offset die to die bonding Grant 7,554,204 - Lai , et al. June 30, 2 | 2009-06-30 |
| Reduction of package height in a stacked die configuration App 20090115033 - Foong; Sally ; et al. | 2009-05-07 |
| Die offset die to die bonding App 20090091043 - Lai; Nguk Chin ; et al. | 2009-04-09 |
| Die offset die to bonding App 20090093084 - Lai; Nguk Chin ; et al. | 2009-04-09 |
| Die Attachment, Die Stacking, And Wire Embedding Using Film App 20090001599 - Foong; Sally ; et al. | 2009-01-01 |
| Process Applying Die Attach Film To Singulated Die App 20080318364 - Foong; Sally ; et al. | 2008-12-25 |
| Die offset die to die bonding App 20080308947 - Lai; Nguk Chin ; et al. | 2008-12-18 |
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