Foong; Chee Seng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Foong; Chee Seng.The latest application filed is for "packaged semiconductor device assembly".
Company Profile
4.51.63
- Foong; Chee Seng - Austin TX
- Foong; Chee Seng - Sg. Buloh MY
- Foong; Chee Seng - Sungai Buloh MY
- Foong; Chee Seng - Selangor N/A MY
- Foong; Chee Seng - Sungei Buloh MY
- Foong; Chee Seng - Putra Sg. MY
- Foong; Chee Seng - Buloh MY
Patent Activity
| Patent | Date |
|---|---|
| Packaged Semiconductor Device Assembly App 20220093499 - Singh; Akhilesh Kumar ; et al. | 2022-03-24 |
| Package with conductive underfill ground plane Grant 11,270,972 - Lakhera , et al. March 8, 2 | 2022-03-08 |
| Device Package Substrate Structure And Method Therefor App 20220059441 - Foong; Chee Seng ; et al. | 2022-02-24 |
| Hybrid package Grant 11,189,557 - Singh , et al. November 30, 2 | 2021-11-30 |
| Method of fabricating embedded traces Grant 11,018,024 - Uehling , et al. May 25, 2 | 2021-05-25 |
| Package With Conductive Underfill Ground Plane App 20200395332 - LAKHERA; Nishant ; et al. | 2020-12-17 |
| Micro-selective sintering laser systems and methods thereof Grant 10,722,947 - Cullinan , et al. | 2020-07-28 |
| Hybrid Package App 20200185319 - Singh; Akhilesh Kumar ; et al. | 2020-06-11 |
| Substrate With Embedded Traces App 20200043750 - Uehling; Trent ; et al. | 2020-02-06 |
| Substrate dielectric crack prevention using interleaved metal plane Grant 10,537,019 - Zhou , et al. Ja | 2020-01-14 |
| Hybrid Package App 20200013711 - Singh; Akhilesh Kumar ; et al. | 2020-01-09 |
| Substrate interconnections for packaged semiconductor device Grant 9,997,445 - Yow , et al. June 12, 2 | 2018-06-12 |
| Packaged semiconductor device having a lead frame and inner and outer leads and method for forming Grant 9,978,669 - Foong May 22, 2 | 2018-05-22 |
| Substrate Interconnections For Packaged Semiconductor Device App 20180114748 - Yow; Kai Yun ; et al. | 2018-04-26 |
| Laser sintered interconnections between die Grant 9,935,079 - Foong , et al. April 3, 2 | 2018-04-03 |
| Micro-selective Sintering Laser Systems And Methods Thereof App 20180065186 - Cullinan; Michael A. ; et al. | 2018-03-08 |
| Packaged Semiconductor Device Having A Lead Frame And Inner And Outer Leads And Method For Forming App 20180005925 - FOONG; CHEE SENG | 2018-01-04 |
| Universal BGA substrate Grant 9,698,093 - Foong , et al. July 4, 2 | 2017-07-04 |
| Universal Bga Substrate App 20170062320 - FOONG; CHEE SENG ; et al. | 2017-03-02 |
| Integrated Circuit With On-die Power Distribution Bars App 20170062311 - Foong; Chee Seng ; et al. | 2017-03-02 |
| Circuit substrate and method of manufacturing same Grant 9,474,162 - Foong , et al. October 18, 2 | 2016-10-18 |
| Substrate for alternative semiconductor die configurations Grant 9,437,492 - Yow , et al. September 6, 2 | 2016-09-06 |
| Semiconductor device package with organic interposer Grant 9,401,345 - Foong , et al. July 26, 2 | 2016-07-26 |
| Integrated Circuit Package With Power Plates App 20160163671 - KUMAR; SHAILESH ; et al. | 2016-06-09 |
| Substrate For Alternative Semiconductor Die Configurations App 20160093533 - Yow; Kai Yun ; et al. | 2016-03-31 |
| Flexible packaged integrated circuit Grant 9,287,236 - Lau , et al. March 15, 2 | 2016-03-15 |
| Semiconductor Device Package With Organic Interposer App 20160064356 - Foong; Chee Seng ; et al. | 2016-03-03 |
| Interposer with overmolded vias Grant 9,269,659 - Foong , et al. February 23, 2 | 2016-02-23 |
| Flexible Packaged Integrated Circuit App 20160020189 - Lau; Teck Beng ; et al. | 2016-01-21 |
| Semiconductor package with lead mounted power bar Grant 9,209,120 - Tiu , et al. December 8, 2 | 2015-12-08 |
| Method of forming pillar bump Grant 9,209,147 - Foong , et al. December 8, 2 | 2015-12-08 |
| Non-homogeneous molding of packaged semiconductor devices Grant 9,202,770 - Foong , et al. December 1, 2 | 2015-12-01 |
| Housing For Electronic Devices App 20150342069 - Foong; Chee Seng | 2015-11-26 |
| Power bar design for lead frame-based packages Grant 9,177,834 - Foong , et al. November 3, 2 | 2015-11-03 |
| Lead Frames Having Metal Traces With Metal Stubs App 20150311143 - Foong; Chee Seng ; et al. | 2015-10-29 |
| Copper pillar bump and flip chip package using same Grant 9,159,682 - Foong , et al. October 13, 2 | 2015-10-13 |
| Semiconductor Package With Lead Mounted Power Bar App 20150262924 - Tiu; Kong Bee ; et al. | 2015-09-17 |
| Stacked die sensor package Grant 9,134,193 - Foong , et al. September 15, 2 | 2015-09-15 |
| Power Bar Design For Lead Frame-based Packages App 20150235924 - Foong; Chee Seng ; et al. | 2015-08-20 |
| Circuit Substrate And Method Of Manufacturing Same App 20150201489 - Foong; Chee Seng ; et al. | 2015-07-16 |
| Wafer Level Package With Redistribution Layer Formed With Metallic Powder App 20150200177 - FOONG; CHEE SENG ; et al. | 2015-07-16 |
| Semiconductor Wafer Dicing Blade App 20150183131 - Foong; Chee Seng ; et al. | 2015-07-02 |
| Stacked Die Sensor Package App 20150160087 - Foong; Chee Seng ; et al. | 2015-06-11 |
| Pillar bump formed using spot-laser Grant 9,053,972 - Foong , et al. June 9, 2 | 2015-06-09 |
| Side vented pressure sensor device Grant 9,040,335 - Boon Yew , et al. May 26, 2 | 2015-05-26 |
| Pillar Bump Formed Using Spot-laser App 20150137354 - Foong; Chee Seng ; et al. | 2015-05-21 |
| Side Vented Pressure Sensor Device App 20150076630 - Low; Boon Yew ; et al. | 2015-03-19 |
| Copper Pillar Bump And Flip Chip Package Using Same App 20150069603 - Foong; Chee Seng ; et al. | 2015-03-12 |
| Pressure Sensor Device And Assembly Method App 20150054099 - Yow; Kai Yun ; et al. | 2015-02-26 |
| Fluid Cooled Semiconductor Die Package App 20140306336 - Foong; Chee Seng ; et al. | 2014-10-16 |
| Fluid cooled semiconductor die package Grant 8,860,212 - Foong , et al. October 14, 2 | 2014-10-14 |
| Semiconductor Packages With Low Stand-off Interconnections Between Chips App 20140231977 - Kalandar; Navas Khan Oratti ; et al. | 2014-08-21 |
| Semiconductor device with redistributed contacts Grant 8,810,020 - Kalandar , et al. August 19, 2 | 2014-08-19 |
| Heat spreader for center gate molding Grant 8,643,172 - Foong , et al. February 4, 2 | 2014-02-04 |
| Semiconductor Device With Redistributed Contacts App 20130341796 - Kalandar; Navas Khan Oratti ; et al. | 2013-12-26 |
| Lead frame for semiconductor package Grant 8,415,779 - Wong , et al. April 9, 2 | 2013-04-09 |
| Heat spreader for semiconductor package Grant 8,049,313 - Foong , et al. November 1, 2 | 2011-11-01 |
| Lead Frame For Semiconductor Package App 20110248390 - WONG; Tzu Ling ; et al. | 2011-10-13 |
| Method of making solder pad Grant 7,566,648 - Yip , et al. July 28, 2 | 2009-07-28 |
| Flip chip and wire bond semiconductor package Grant 7,554,185 - Foong , et al. June 30, 2 | 2009-06-30 |
| Heat Spreader For Center Gate Molding App 20080305584 - Foong; Chee Seng ; et al. | 2008-12-11 |
| Capacitor attachment method Grant 7,452,750 - Lo , et al. November 18, 2 | 2008-11-18 |
| Method Of Making Solder Pad App 20080258297 - YIP; Heng Keong ; et al. | 2008-10-23 |
| Method of packaging semiconductor die without lead frame or substrate Grant 7,432,130 - Ismail , et al. October 7, 2 | 2008-10-07 |
| Flip Chip And Wire Bond Semiconductor Package App 20080111248 - Foong; Chee Seng ; et al. | 2008-05-15 |
| Heat Spreader For Semiconductor Package App 20080067645 - Foong; Chee Seng ; et al. | 2008-03-20 |
| Packaged device and method of forming same Grant 7,285,855 - Foong October 23, 2 | 2007-10-23 |
| Capacitor attachment method App 20070202632 - Lo; Wai Yew ; et al. | 2007-08-30 |
| Method of packaging semiconductor die App 20070178626 - Ismail; Aminuddin ; et al. | 2007-08-02 |
| Method of making semiconductor package having exposed heat spreader App 20070122943 - Foong; Chee Seng ; et al. | 2007-05-31 |
| Packaged Device And Method Of Forming Same App 20070114664 - Foong; Chee Seng | 2007-05-24 |
| Packaged device and method of forming same Grant 7,179,682 - Foong February 20, 2 | 2007-02-20 |
| Packaged device and method of forming same App 20060087038 - Foong; Chee Seng | 2006-04-27 |
| Semiconductor package including rivet for bonding of lead posts App 20060012055 - Foong; Chee Seng ; et al. | 2006-01-19 |
| Image sensor device Grant 6,900,531 - Foong , et al. May 31, 2 | 2005-05-31 |
| Image sensor device App 20040080037 - Foong, Chee Seng ; et al. | 2004-04-29 |
| Flip chip optical and imaging sensor device App 20040065933 - Foong, Chee Seng ; et al. | 2004-04-08 |
| Stacked die semiconductor device App 20030111720 - Tan, Lan Chu ; et al. | 2003-06-19 |
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