Fook; Jeffrey Toh Tuck

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fook; Jeffrey Toh Tuck.The latest application filed is for "method for ball grid array chip packages having improved testing and stacking characteristics".

Company Profile

0.14.8

Fook; Jeffrey Toh Tuck - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chip on board leadframe for semiconductor components having area array Grant 7,459,778 - Kim , et al. December 2, 2	2008-12-02
Method for ball grid array chip packages having improved testing and stacking characteristics Grant 7,116,122 - Tay , et al. October 3, 2	2006-10-03
Method for fabricating semiconductor component with chip on board leadframe Grant 7,049,173 - Kim , et al. May 23, 2	2006-05-23
Method for ball grid array chip packages having improved testing and stacking characteristics App 20050127531 - Tay, Wuu Yean ; et al.	2005-06-16
Semiconductor component having chip on board leadframe Grant 6,903,449 - Kim , et al. June 7, 2	2005-06-07
Method for fabricating semiconductor component with chip on board leadframe App 20050023654 - Seng Kim, Dalson Ye ; et al.	2005-02-03
Semiconductor component having chip on board leadframe and method of fabrication App 20050023651 - Kim, Dalson Ye Seng ; et al.	2005-02-03
Method for ball grid array chip packages having improved testing and stacking characteristics Grant 6,847,220 - Tay , et al. January 25, 2	2005-01-25
Method for ball grind array chip packages having improved testing and stacking characteristics Grant 6,740,983 - Tay , et al. May 25, 2	2004-05-25
Ball grid array chip packages having improved testing and stacking characteristics Grant 6,740,984 - Tay , et al. May 25, 2	2004-05-25
Ball grid array chip packages having improved testing and stacking characteristics Grant 6,693,363 - Tay , et al. February 17, 2	2004-02-17
Ball grid array chip packages having improved testing and stacking characteristics Grant 6,674,175 - Tay , et al. January 6, 2	2004-01-06
Method for ball grid array chip packages having improved testing and stacking characteristics Grant 6,600,335 - Tay , et al. July 29, 2	2003-07-29
Ball grid array chip packages having improved testing and stacking characteristics App 20030112614 - Tay, Wuu Yean ; et al.	2003-06-19
Ball grid array chip packages having improved testing and stacking characteristics Grant 6,522,018 - Tay , et al. February 18, 2	2003-02-18
Ball grid array chip packages having improved testing and stacking characteristics Grant 6,522,019 - Tay , et al. February 18, 2	2003-02-18
Ball grid array chip packages having improved testing and stacking characteristics App 20030001288 - Tay, Wuu Yean ; et al.	2003-01-02
Ball grid array chip packages having improved testing and stacking characteristics App 20020153602 - Tay, Wuu Yean ; et al.	2002-10-24
Ball grid array chip packages having improved testing and stacking characteristics App 20020130413 - Tay, Wuu Yean ; et al.	2002-09-19
Ball grid array chip packages having improved testing and stacking characteristics Grant 6,448,664 - Tay , et al. September 10, 2	2002-09-10
Ball grid array chip packages having improved testing and stacking characteristics Grant 6,420,789 - Tay , et al. July 16, 2	2002-07-16
Ball grid array chip packages having improved testing and stacking characteristics App 20020043986 - Tay, Wuu Yean ; et al.	2002-04-18

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