FONG; Lim
Patent Applications and Registrations
Patent applications and USPTO patent grants for FONG; Lim.The latest application filed is for "chip arrangements".
- FONG; Lim - Melaka MY
- Fong; Lim - Ayer Keroh MY
| Patent | Date |
|---|---|
| Chip Arrangements App 20210167034 - MENGEL; Manfred ; et al. | 2021-06-03 |
| Chip arrangements Grant 10,930,614 - Mengel , et al. February 23, 2 | 2021-02-23 |
| Chip Arrangements App 20170323865 - MENGEL; Manfred ; et al. | 2017-11-09 |
| Solder alloys and arrangements Grant 9,735,126 - Mengel , et al. August 15, 2 | 2017-08-15 |
| Solder Alloys And Arrangements App 20120313230 - MENGEL; Manfred ; et al. | 2012-12-13 |
| Die attach method and leadframe structure Grant 7,859,090 - Bayan , et al. December 28, 2 | 2010-12-28 |
| Die Attach Method And Leadframe Structure App 20090315161 - BAYAN; Jaime A. ; et al. | 2009-12-24 |
| Die attach method and microarray leadframe structure Grant 7,598,122 - Bayan , et al. October 6, 2 | 2009-10-06 |
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