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Patent applications and USPTO patent grants for FON; Bih Wen.The latest application filed is for "packaged semiconductor devices and related methods".
Patent | Date |
---|---|
Packaged Semiconductor Devices And Related Methods App 20170162742 - PRAJUCKAMOL; Atapol ;   et al. | 2017-06-08 |
Packaged Semiconductor Devices And Related Methods App 20160111581 - Prajuckamol; Atapol ;   et al. | 2016-04-21 |
Chip scale packages and related methods Grant 9,281,258 - Fon , et al. March 8, 2 | 2016-03-08 |
Chip-on-lead package and method of forming Grant 9,018,044 - Prajuckamol , et al. April 28, 2 | 2015-04-28 |
Chip-on-lead Package And Method Of Forming App 20140248747 - Prajuckamol; Atapol ;   et al. | 2014-09-04 |
Chip-on-lead package and method of forming Grant 8,759,978 - Prajuckamol , et al. June 24, 2 | 2014-06-24 |
Chip-on-lead Package And Method Of Forming App 20130168866 - Prajuckamol; Atapol ;   et al. | 2013-07-04 |
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