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Patent applications and USPTO patent grants for Folaron; Robert J..The latest application filed is for "charged particle beam device probe operation".
Patent | Date |
---|---|
Patterned atomic layer epitaxy Grant 7,799,132 - Randall , et al. September 21, 2 | 2010-09-21 |
Charged particle beam device probe operation Grant 7,675,300 - Baur , et al. March 9, 2 | 2010-03-09 |
Charged Particle Beam Device Probe Operation App 20080150557 - BAUR; Christof ;   et al. | 2008-06-26 |
Patterned Atomic Layer Epitaxy App 20080092803 - Randall; John N. ;   et al. | 2008-04-24 |
Patterned atomic layer epitaxy Grant 7,326,293 - Randall , et al. February 5, 2 | 2008-02-05 |
Charged particle beam device probe operation Grant 7,319,336 - Baur , et al. January 15, 2 | 2008-01-15 |
Charged particle beam device probe operation App 20060192116 - Baur; Christof ;   et al. | 2006-08-31 |
Patterned atomic layer epitaxy App 20050223968 - Randall, John N. ;   et al. | 2005-10-13 |
Apparatus for automatically positioning electronic dice within component packages Grant 6,900,459 - Farnworth , et al. May 31, 2 | 2005-05-31 |
Method and apparatus for automatically positioning electronic dice within component packages App 20030088973 - Farnworth, Warren M. ;   et al. | 2003-05-15 |
Method for automatically positioning electronic die within component packages Grant 6,492,187 - Farnworth , et al. December 10, 2 | 2002-12-10 |
Method for positioning a semiconductor die within a temporary package Grant 6,353,312 - Farnworth , et al. March 5, 2 | 2002-03-05 |
Method and apparatus for automatically positioning electronic dice within component packages Grant 6,064,194 - Farnworth , et al. May 16, 2 | 2000-05-16 |
Method and apparatus for automatically positioning electronic dice within component packages Grant 5,955,877 - Farnworth , et al. September 21, 1 | 1999-09-21 |
Method and apparatus for automatically positioning electronic dice within component packages Grant 5,894,218 - Farnworth , et al. April 13, 1 | 1999-04-13 |
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