| Patent | Date |
|---|
Coaxial probe structure of elongated electrical conductors projecting from a support structure
Grant 9,404,942 - Beaman , et al. August 2, 2 | 2016-08-02 |
Redox Method Of Forming A Coaxial Probe Structure Of Elongated Electrical Conductors Projecting From A Support Structure
App 20140191775 - Beaman; Brian Samuel ; et al. | 2014-07-10 |
Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof
Grant 8,754,666 - Beaman , et al. June 17, 2 | 2014-06-17 |
Redox method of forming a coaxial probe structure of elongated electrical conductors projecting from a support structure
Grant 8,491,772 - Beaman , et al. July 23, 2 | 2013-07-23 |
Electrodeposition method of forming a probe structure having a plurality of discrete insulated probe tips projecting from a support surface
Grant 8,486,250 - Beaman , et al. July 16, 2 | 2013-07-16 |
Amorphization/templated recrystallization method for hybrid orientation substrates
Grant 7,960,263 - Fogel , et al. June 14, 2 | 2011-06-14 |
Amorphization/templated Recrystallization Method For Hybrid Orientation Substrates
App 20100203708 - Fogel; Keith Edward ; et al. | 2010-08-12 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20100052715 - Beaman; Brian Samuel ; et al. | 2010-03-04 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20100045321 - Beaman; Brian Samuel ; et al. | 2010-02-25 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20100045266 - Beaman; Brian Samuel ; et al. | 2010-02-25 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20100045317 - Beaman; Brian Samuel ; et al. | 2010-02-25 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20100045320 - Beaman; Brian Samuel ; et al. | 2010-02-25 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20100045324 - Beaman; Brian Samuel ; et al. | 2010-02-25 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20100045318 - Beaman; Brian Samuel ; et al. | 2010-02-25 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20090315579 - Beaman; Brian Samuel ; et al. | 2009-12-24 |
Probe Structure Coaxial Elongated Electrical Conductor Projecting From A Support Surface, Apparatus For Use Thereof And Methods Of Fabrication Thereof
App 20090308756 - Beaman; Brian Samuel ; et al. | 2009-12-17 |
Techniques for Layer Transfer Processing
App 20090233079 - Bedell; Stephen W. ; et al. | 2009-09-17 |
Angled Flying Lead Wire Bonding Process
App 20090189288 - Beaman; Brian Samuel ; et al. | 2009-07-30 |
Method for fabricating low-defect-density changed orientation Si
Grant 7,550,369 - de Souza , et al. June 23, 2 | 2009-06-23 |
High density integrated circuit apparatus, test probe and methods of use thereof
Grant 7,538,565 - Beaman , et al. May 26, 2 | 2009-05-26 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20090128176 - Beaman; Brian Samuel ; et al. | 2009-05-21 |
Angled flying lead wire bonding process
Grant 7,495,342 - Beaman , et al. February 24, 2 | 2009-02-24 |
Techniques for Layer Transfer Processing
App 20080280416 - Bedell; Stephen W. ; et al. | 2008-11-13 |
Probe Structure Having A Plurality Of Discrete Insulated Probe Tips Projecting From A Support Surface, Apparatus For Use Thereof And Methods Of Fabrication Thereof
App 20080164896 - Beaman; Brian Samuel ; et al. | 2008-07-10 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080129320 - Beaman; Brian Samuel ; et al. | 2008-06-05 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080129319 - Beaman; Brian Samuel ; et al. | 2008-06-05 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080132094 - Beaman; Brian Samuel ; et al. | 2008-06-05 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080123310 - Beaman; Brian Samuel ; et al. | 2008-05-29 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080121879 - Beaman; Brian Samuel ; et al. | 2008-05-29 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080116916 - Beaman; Brian Samuel ; et al. | 2008-05-22 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080116913 - Beaman; Brian Samuel ; et al. | 2008-05-22 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080117611 - Beaman; Brian Samuel ; et al. | 2008-05-22 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080116914 - Beaman; Brian Samuel ; et al. | 2008-05-22 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080116912 - Beaman; Brian Samuel ; et al. | 2008-05-22 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080117613 - Beaman; Brian Samuel ; et al. | 2008-05-22 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080117612 - Beaman; Brian Samuel ; et al. | 2008-05-22 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080116915 - Beaman; Brian Samuel ; et al. | 2008-05-22 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080112145 - Beaman; Brian Samuel ; et al. | 2008-05-15 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080111569 - Beaman; Brian Samuel ; et al. | 2008-05-15 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080111568 - Beaman; Brian Samuel ; et al. | 2008-05-15 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080111570 - Beaman; Brian Samuel ; et al. | 2008-05-15 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080112144 - Beaman; Brian Samuel ; et al. | 2008-05-15 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080112147 - Beaman; Brian Samuel ; et al. | 2008-05-15 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080112149 - Beaman; Brian Samuel ; et al. | 2008-05-15 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080112148 - Beaman; Brian Samuel ; et al. | 2008-05-15 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080112146 - Beaman; Brian Samuel ; et al. | 2008-05-15 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080106281 - Beaman; Brian Samuel ; et al. | 2008-05-08 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080106291 - Beaman; Brian Samuel ; et al. | 2008-05-08 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080106283 - Beaman; Brian Samuel ; et al. | 2008-05-08 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080106285 - Beaman; Brian Samuel ; et al. | 2008-05-08 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080106284 - Beaman; Brian Samuel ; et al. | 2008-05-08 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080106282 - Beaman; Brian Samuel ; et al. | 2008-05-08 |
Amorphization/templated Recrystallization Method For Hybrid Orientation Substrates
App 20080108204 - Fogel; Keith Edward ; et al. | 2008-05-08 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080106872 - Beaman; Brian Samuel ; et al. | 2008-05-08 |
Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof
Grant 7,368,924 - Beaman , et al. May 6, 2 | 2008-05-06 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080100317 - Beaman; Brian Samuel ; et al. | 2008-05-01 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080100318 - Beaman; Brian Samuel ; et al. | 2008-05-01 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080100316 - Beaman; Brian Samuel ; et al. | 2008-05-01 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080100324 - Beaman; Brian Samuel ; et al. | 2008-05-01 |
High Density Cantilevered Probe For Electronic Devices
App 20080088332 - Beaman; Brian Samuel ; et al. | 2008-04-17 |
METHOD FOR FABRICATING LOW-DEFECT-DENSITY CHANGED ORIENTATION Si
App 20080057684 - de Souza; Joel Pereira ; et al. | 2008-03-06 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080048690 - Beaman; Brian Samuel ; et al. | 2008-02-28 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080048691 - Beaman; Brian Samuel ; et al. | 2008-02-28 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080048697 - Beaman; Brian Samuel ; et al. | 2008-02-28 |
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof
App 20080047741 - Beaman; Brian Samuel ; et al. | 2008-02-28 |
Method for fabricating a structure for making contact with a device
Grant 7,332,922 - Beaman , et al. February 19, 2 | 2008-02-19 |
High Density Cantilevered Probe For Electronic Devices
App 20080030215 - Beaman; Brian Samuel ; et al. | 2008-02-07 |
High Density Cantilevered Probe For Electronic Devices
App 20080024155 - Beaman; Brian Samuel ; et al. | 2008-01-31 |
High Density Cantilevered Probe For Electronic Devices
App 20080024154 - Beaman; Brian Samuel ; et al. | 2008-01-31 |
Techniques for Layer Transfer Processing
App 20070281439 - Bedell; Stephen W. ; et al. | 2007-12-06 |
High density integrated circuit apparatus, test probe and methods of use thereof
App 20070271781 - Beaman; Brian Samuel ; et al. | 2007-11-29 |
Amorphization/templated recrystallization method for hybrid orientation substrates
Grant 7,291,539 - Fogel , et al. November 6, 2 | 2007-11-06 |
Method for fabricating low-defect-density changed orientation Si
Grant 7,285,473 - Pereira de Souza , et al. October 23, 2 | 2007-10-23 |
Wafer scale high density probe assembly, apparatus for use thereof and methods of fabrication thereof
Grant 7,282,945 - Beaman , et al. October 16, 2 | 2007-10-16 |
High density integral test probe
Grant 7,276,919 - Beaman , et al. October 2, 2 | 2007-10-02 |
Amorphization/templated recrystallization method for hybrid orientation substrates
App 20060276011 - Fogel; Keith Edward ; et al. | 2006-12-07 |
Method for fabricating low-defect-density changed orientation Si
App 20060154429 - de Souza; Joel Pereira ; et al. | 2006-07-13 |
High density cantilevered probe for electronic devices
App 20050179456 - Beaman, Brian Samuel ; et al. | 2005-08-18 |
Plated probe structure
Grant 6,891,360 - Beaman , et al. May 10, 2 | 2005-05-10 |
Techniques for layer transfer processing
App 20050082526 - Bedell, Stephen W. ; et al. | 2005-04-21 |
Method for fabricating a structure for making contact with an IC device
Grant 6,880,245 - Beaman , et al. April 19, 2 | 2005-04-19 |
High density integrated circuit apparatus, test probe and methods of use thereof
App 20050062492 - Beaman, Brian Samuel ; et al. | 2005-03-24 |
Angled flying lead wire bonding process
App 20040148773 - Beaman, Brian Samuel ; et al. | 2004-08-05 |
Compliant interposer assembly for wafer test and "burn-in" operations
App 20040135594 - Beaman, Brian Samuel ; et al. | 2004-07-15 |
High density cantilevered probe for electronic devices
App 20040130343 - Beaman, Brian Samuel ; et al. | 2004-07-08 |
Method of forming a structure for electronic devices contact locations
Grant 6,722,032 - Beaman , et al. April 20, 2 | 2004-04-20 |
Angled flying lead wire bonding process
Grant 6,708,403 - Beaman , et al. March 23, 2 | 2004-03-23 |
Angled flying lead wire bonding process
App 20030106213 - Beaman, Brian Samuel ; et al. | 2003-06-12 |
Structural design and processes to control probe position accuracy in a wafer test probe assembly
App 20030048108 - Beaman, Brian Samuel ; et al. | 2003-03-13 |
Integrated compliant probe for wafer level test and burn-in
Grant 6,528,984 - Beaman , et al. March 4, 2 | 2003-03-04 |
Angled flying lead wire bonding process
Grant 6,526,655 - Beaman , et al. March 4, 2 | 2003-03-04 |
Process and structure to repair damaged probes mounted on a space transformer
Grant 6,523,255 - Shih , et al. February 25, 2 | 2003-02-25 |
Probe structures for testing electrical interconnections to integrated circuit electronic devices
Grant 6,525,551 - Beaman , et al. February 25, 2 | 2003-02-25 |
Process and structure to repair damaged probes mounted on a space transformer
App 20020194730 - Shih, Da-Yuan ; et al. | 2002-12-26 |
Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof
App 20020190738 - Beaman, Brian Samuel ; et al. | 2002-12-19 |
Deformable coated wick liquid spilled material transfer
App 20020150783 - Hougham, Gareth Geoffrey ; et al. | 2002-10-17 |
Integrated Compliant Probe For Wafer Level Test And Burn-in
App 20020130676 - BEAMAN, BRIAN SAMUEL ; et al. | 2002-09-19 |
Probe structure having a plurality of discrete insulated probe tips
Grant 6,452,406 - Beaman , et al. September 17, 2 | 2002-09-17 |
Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof
App 20020089344 - Beaman, Brian Samuel ; et al. | 2002-07-11 |
High density integrated circuit apparatus, test probe and methods of use thereof
App 20020014004 - Beaman, Brian Samuel ; et al. | 2002-02-07 |
High density integral test probe and fabrication method
App 20020011001 - Beaman, Brian Samuel ; et al. | 2002-01-31 |
High density integrated circuit apparatus, test probe and methods of use thereof
Grant 6,334,247 - Beaman , et al. January 1, 2 | 2002-01-01 |
High density cantilevered probe for electronic devices
App 20010054907 - Beaman, Brian Samuel ; et al. | 2001-12-27 |
Method of making high density integral test probe
Grant 6,332,270 - Beaman , et al. December 25, 2 | 2001-12-25 |
High density cantilevered probe for electronic devices
Grant 6,329,827 - Beaman , et al. December 11, 2 | 2001-12-11 |
Angled flying lead wire bonding process
App 20010045012 - Beaman, Brian Samuel ; et al. | 2001-11-29 |
Method Of Making A High Density Integral Test Probe
App 20010040460 - BEAMAN, BRIAN SAMUEL ; et al. | 2001-11-15 |
High density integrated circuit apparatus, test probe and methods of use thereof
Grant 6,300,780 - Beaman , et al. October 9, 2 | 2001-10-09 |
Angled flying lead wire bonding process
Grant 6,295,729 - Beaman , et al. October 2, 2 | 2001-10-02 |
Interconnector with contact pads having enhanced durability
Grant 6,286,208 - Shih , et al. September 11, 2 | 2001-09-11 |
Structures and processes to create a desired probetip contact geometry on a wafer test probe
Grant 6,206,273 - Beaman , et al. March 27, 2 | 2001-03-27 |
Pluggable chip scale package
Grant 6,078,500 - Beaman , et al. June 20, 2 | 2000-06-20 |
High density test probe with rigid surface structure
Grant 6,062,879 - Beaman , et al. May 16, 2 | 2000-05-16 |
Foamed elastomers for wafer probing applications and interposer connectors
Grant 6,054,651 - Fogel , et al. April 25, 2 | 2000-04-25 |
High density cantilevered probe for electronic devices
Grant 5,914,614 - Beaman , et al. June 22, 1 | 1999-06-22 |
Methods of fabrication of coaxial vias and magnetic devices
Grant 5,898,991 - Fogel , et al. May 4, 1 | 1999-05-04 |
Integral rigid chip test probe
Grant 5,838,160 - Beaman , et al. November 17, 1 | 1998-11-17 |
Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof
Grant 5,821,763 - Beaman , et al. October 13, 1 | 1998-10-13 |
High density cantilevered probe for electronic devices
Grant 5,811,982 - Beaman , et al. September 22, 1 | 1998-09-22 |
Interconnector with contact pads having enhanced durability
Grant 5,810,607 - Shih , et al. September 22, 1 | 1998-09-22 |
High density test probe with rigid surface structure
Grant 5,785,538 - Beaman , et al. July 28, 1 | 1998-07-28 |
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