Fluegge; Martin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fluegge; Martin.The latest application filed is for "stabilized etching solutions for cu and cu/ni layers".
- Fluegge; Martin - Wiesbaden DE
| Patent | Date |
|---|---|
| Stabilized etching solutions for CU and CU/NI layers Grant 8,652,972 - Fluegge , et al. February 18, 2 | 2014-02-18 |
| Stabilized Etching Solutions For Cu And Cu/ni Layers App 20100304573 - Fluegge; Martin ; et al. | 2010-12-02 |
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