loadpatents
name:-0.017352104187012
name:-0.0073258876800537
name:-0.0062899589538574
FLUEGEL; Alexander Patent Filings

FLUEGEL; Alexander

Patent Applications and Registrations

Patent applications and USPTO patent grants for FLUEGEL; Alexander.The latest application filed is for "composition for cobalt electroplating comprising leveling agent".

Company Profile
7.8.18
  • FLUEGEL; Alexander - Ludwigshafen DE
  • FLUEGEL; Alexander - Bad Duerkheim DE
  • Fluegel, Alexander - Muenchen DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Composition for Cobalt Electroplating Comprising Leveling Agent
App 20220298664 - ENGELHARDT; Nadine ;   et al.
2022-09-22
Composition for metal electroplating comprising leveling agent
Grant 11,387,108 - Kienle , et al. July 12, 2
2022-07-12
Composition for cobalt electroplating comprising leveling agent
Grant 11,377,748 - Engelhardt , et al. July 5, 2
2022-07-05
Composition For Tin Or Tin Alloy Electroplating Comprising Suppressing Agent
App 20220119972 - FLUEGEL; Alexander ;   et al.
2022-04-21
Composition for tin or tin alloy electroplating comprising suppressing agent
Grant 11,242,606 - Fluegel , et al. February 8, 2
2022-02-08
Composition For Cobalt Plating Comprising Additive For Void-free Submicron Feature Filling
App 20220018035 - Katayaporn; Sathana ;   et al.
2022-01-20
Composition For Tin Or Tin Alloy Electroplating Comprising Suppressing Agent
App 20210180201 - FLUEGEL; Alexander ;   et al.
2021-06-17
Composition For Tin Or Tin Alloy Electroplating Comprising Suppressing Agent
App 20210079548 - FLUEGEL; Alexander ;   et al.
2021-03-18
Composition For Cobalt Plating Comprising Additive For Void-free Submicron Feature Filling
App 20210040635 - KIENLE; Marcel Patrik ;   et al.
2021-02-11
Composition For Tin-silver Alloy Electroplating Comprising A Complexing Agent
App 20210025070 - FRITZSCHE; Katharina ;   et al.
2021-01-28
Composition For Cobalt Electroplating Comprising Leveling Agent
App 20200347503 - ENGELHARDT; Nadine ;   et al.
2020-11-05
Composition For Metal Electroplating Comprising Leveling Agent
App 20200185224 - KIENLE; Marcel Patrik ;   et al.
2020-06-11
Composition For Tin Or Tin Alloy Electroplating Comprising Leveling Agent
App 20200115813 - FLUEGEL; Alexander ;   et al.
2020-04-16
Composition For Metal Plating Comprising Suppressing Agent For Void Free Filing
App 20190309429 - KIENLE; Marcel Patrik ;   et al.
2019-10-10
Composition For Cobalt Plating Comprising Additive For Void-free Submicron Feature Filling
App 20190226107 - KIENLE; Marcel Patrik ;   et al.
2019-07-25
Composition for metal electroplating comprising leveling agent
Grant 9,758,885 - Kienle , et al. September 12, 2
2017-09-12
Composition for metal electroplating comprising leveling agent
Grant 9,683,302 - Siemer , et al. June 20, 2
2017-06-20
Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features
Grant 9,631,292 - Roeger-Goepfert , et al. April 25, 2
2017-04-25
Composition For Metal Electroplating Comprising Leveling Agent
App 20150284865 - Kienle; Marcel Patrik ;   et al.
2015-10-08
Composition For Metal Electroplating Comprising An Additive For Bottom-up Filling Of Though Silicon Vias And Interconnect Features
App 20140097092 - Roeger-Goepfert; Cornelia ;   et al.
2014-04-10
Composition For Metal Electroplating Comprising Leveling Agent
App 20130068626 - Siemer; Michael ;   et al.
2013-03-21
Genetically modified T-cells, method for producing them and use thereof
App 20020119571 - Ritter, Thomas ;   et al.
2002-08-29

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