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name:-0.0035560131072998
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FLOW JAPAN CORPORATION Patent Filings

FLOW JAPAN CORPORATION

Patent Applications and Registrations

Patent applications and USPTO patent grants for FLOW JAPAN CORPORATION.The latest application filed is for "control device for machining apparatus, machining apparatus, and correction method of machining data".

Company Profile
0.4.1
  • FLOW JAPAN CORPORATION - Tokyo JP
  • FLOW JAPAN CORPORATION - Shibuya-ku, Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Control device for machining apparatus, machining apparatus, and correction method of machining data
Grant 9,897,993 - Kanazawa , et al. February 20, 2
2018-02-20
Abrasive water-jet machining device
Grant 9,193,036 - Kanazawa , et al. November 24, 2
2015-11-24
Stringer manufacturing method
Grant 9,149,909 - Kanazawa , et al. October 6, 2
2015-10-06
Control Device For Machining Apparatus, Machining Apparatus, And Correction Method Of Machining Data
App 20150248125 - Kanazawa; Hiroyuki ;   et al.
2015-09-03

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