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Patent applications and USPTO patent grants for FLOW JAPAN CORPORATION.The latest application filed is for "control device for machining apparatus, machining apparatus, and correction method of machining data".
Patent | Date |
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Control device for machining apparatus, machining apparatus, and correction method of machining data Grant 9,897,993 - Kanazawa , et al. February 20, 2 | 2018-02-20 |
Abrasive water-jet machining device Grant 9,193,036 - Kanazawa , et al. November 24, 2 | 2015-11-24 |
Stringer manufacturing method Grant 9,149,909 - Kanazawa , et al. October 6, 2 | 2015-10-06 |
Control Device For Machining Apparatus, Machining Apparatus, And Correction Method Of Machining Data App 20150248125 - Kanazawa; Hiroyuki ;   et al. | 2015-09-03 |
NCAGE Code | SWL65 | FLOW JAPAN CORPORATION |
NCAGE Code | SCG65 | FLOW JAPAN CORPORATION |
CAGE Code | SCG65 | FLOW JAPAN CORPORATION |
CAGE Code | SWL65 | FLOW JAPAN CORPORATION |
S.A.M. Registration | SWL65 [701331894] | FLOW JAPAN CORPORATION |
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