Fleury; Herve
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fleury; Herve.The latest application filed is for "method of manufacturing a system in package".
- Fleury; Herve - Caen FR
- Fleury; Herve - Lisieux FR
| Patent | Date |
|---|---|
| IC testing methods and apparatus Grant 8,327,205 - Waayers , et al. December 4, 2 | 2012-12-04 |
| Method of manufacturing a system in package Grant 7,960,189 - Cauvet , et al. June 14, 2 | 2011-06-14 |
| Testable electronic circuit Grant 7,899,641 - Fleury , et al. March 1, 2 | 2011-03-01 |
| Method Of Manufacturing A System In Package App 20090148966 - Cauvet; Philippe L. L. ; et al. | 2009-06-11 |
| Electronic circuit comprising a secret sub-module Grant 7,519,496 - Yannou , et al. April 14, 2 | 2009-04-14 |
| Ic Testing Methods and Apparatus App 20090003424 - Waayers; Tom ; et al. | 2009-01-01 |
| Testable Electronic Circuit App 20080133167 - Fleury; Herve ; et al. | 2008-06-05 |
| Electronic circuit comprising a secret sub-module App 20070088519 - Yannou; Jean-Marc ; et al. | 2007-04-19 |
| Low pin count, high-speed boundary scan testing Grant 7,124,340 - Bos , et al. October 17, 2 | 2006-10-17 |
| Method for testing a testable electronic device App 20030041296 - Bos, Gerardus Arnoldus Antonius ; et al. | 2003-02-27 |
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