Fjelstad; Joseph

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fjelstad; Joseph.The latest application filed is for "solder alloy free electronic (safe) rigid-flexible/stretchable circuit assemblies having integral, conductive and heat spreading sections and methods for their manufacture".

Company Profile

2.101.53

Fjelstad; Joseph - Maple Valley WA US
Fjelstad; Joseph - North Bend WA
Fjelstad; Joseph - Sunnyvale CA
Fjelstad; Joseph - Sunnvale CA
Fjelstad; Joseph - ul. Centralnay d.20 kw.122 SU

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Solder alloy free electronic (safe) rigid-flexible/stretchable circuit assemblies having integral, conductive and heat spreading sections and methods for their manufacture Grant 10,285,270 - Fjelstad	2019-05-07
Backgammon board Grant D791,881 - Fjelstad July 11, 2	2017-07-11
Solder alloy free electronic (safe) rigid-flexible/stretchable circuit assemblies having integral, conductive and heat spreading sections and methods for their manufacture App 20160037623 - Fjelstad; Joseph	2016-02-04
Methods Of Making Compliant Semiconductor Chip Packages App 20150194347 - Fjelstad; Joseph ; et al.	2015-07-09
Methods Of Making Compliant Semiconductor Chip Packages App 20140042634 - Fjelstad; Joseph ; et al.	2014-02-13
Methods of making compliant semiconductor chip packages Grant 8,558,386 - Fjelstad , et al. October 15, 2	2013-10-15
Method of electrically connecting a microelectronic component Grant 8,513,799 - Fjelstad August 20, 2	2013-08-20
Microelectronic assemblies having compliant layers Grant 8,338,925 - Fjelstad , et al. December 25, 2	2012-12-25
Separable, keyed electrical/electronic modules for mating to LED lighting assemblies App 20120319595 - Antonopoulos; Nicholas ; et al.	2012-12-20
Methods for providing void-free layer for semiconductor assemblies Grant RE43,404 - DiStefano , et al. May 22, 2	2012-05-22
Method of electrically connecting a microelectronic component Grant 8,148,205 - Fjelstad April 3, 2	2012-04-03
Method of electrically connecting a microelectronic component Grant 8,148,199 - Fjelstad April 3, 2	2012-04-03
Method of electrically connecting a microelectronic component Grant 8,114,711 - Fjelstad February 14, 2	2012-02-14
Microelectronic Assemblies Having Compliant Layers App 20110095441 - Fjelstad; Joseph ; et al.	2011-04-28
Microelectronic assemblies having compliant layers Grant 7,872,344 - Fjelstad , et al. January 18, 2	2011-01-18
Methods of making compliant semiconductor chip packages App 20100035382 - Fjelstad; Joseph ; et al.	2010-02-11
Method of electrically connecting a microelectronic component App 20090236406 - Fjelstad; Joseph	2009-09-24
Method of electrically connecting a microelectronic component App 20090200654 - Fjelstad; Joseph	2009-08-13
Method of electrically connecting a microelectronic component App 20090200655 - Fjelstad; Joseph	2009-08-13
Method of electrically connecting a microelectronic component Grant 7,531,894 - Fjelstad May 12, 2	2009-05-12
Method of electrically connecting a microelectronic component Grant 7,528,008 - Fjelstad May 5, 2	2009-05-05
Microelectronic assemblies having compliant layers Grant 7,408,260 - Fjelstad , et al. August 5, 2	2008-08-05
Methods of making microelectronic packages with conductive elastomeric posts Grant 7,276,400 - Fjelstad October 2, 2	2007-10-02
Structures and methods for wire bonding over active, brittle and low K dielectric areas of an IC chip Grant 7,176,580 - Fjelstad February 13, 2	2007-02-13
Methods for manufacturing resistors using a sacrificial layer Grant 7,165,316 - Fjelstad January 23, 2	2007-01-23
Microelectronic assemblies having compliant layers App 20060261476 - Fjelstad; Joseph ; et al.	2006-11-23
Method of electrically connecting a microelectronic component Grant 7,138,299 - Fjelstad November 21, 2	2006-11-21
Microelectronic assemblies having compliant layers App 20060237836 - Fjelstad; Joseph ; et al.	2006-10-26
Microelectronic assemblies having compliant layers Grant 7,112,879 - Fjelstad , et al. September 26, 2	2006-09-26
Semiconductor package having light sensitive chips Grant 7,095,054 - Fjelstad August 22, 2	2006-08-22
Methods for manufacturing resistors using a sacrificial layer Grant 7,091,820 - Fjelstad August 15, 2	2006-08-15
Connection component with peelable leads Grant 7,067,742 - DiStefano , et al. June 27, 2	2006-06-27
Resistor process Grant 7,049,929 - Fjelstad May 23, 2	2006-05-23
Methods of making microelectronic packages with conductive elastomeric posts App 20060084250 - Fjelstad; Joseph	2006-04-20
Method for making a microelectronic interposer App 20060040522 - Distefano; Thomas H. ; et al.	2006-02-23
Method for making a microelectronic interposer Grant 6,978,538 - DiStefano , et al. December 27, 2	2005-12-27
Compliant package with conductive elastomeric posts Grant 6,972,495 - Fjelstad December 6, 2	2005-12-06
Method of making an electronic contact Grant 6,938,338 - Fjelstad , et al. September 6, 2	2005-09-06
Method of bonding a semiconductor die without an ESD circuit and a separate ESD circuit to an external lead, and a semiconductor device made thereby Grant 6,933,610 - Segaram , et al. August 23, 2	2005-08-23
Methods of making microelectronic assemblies App 20050155223 - Fjelstad, Joseph ; et al.	2005-07-21
Microelectronic elements with deformable leads Grant 6,906,422 - Fjelstad June 14, 2	2005-06-14
Semiconductor package having light sensitive chips Grant 6,888,168 - Fjelstad May 3, 2	2005-05-03
Stacked microelectronic assemblies and methods of making same Grant 6,885,106 - Damberg , et al. April 26, 2	2005-04-26
Methods and structures for electronic probing arrays Grant 6,876,212 - Fjelstad April 5, 2	2005-04-05
Semiconductor package having light sensitive chips App 20050035357 - Fjelstad, Joseph	2005-02-17
Methods for manufacturing resistors using a sacrificial layer Grant 6,856,235 - Fjelstad February 15, 2	2005-02-15
Microelectric packages having deformed bonded leads and methods therefor Grant 6,848,173 - Fjelstad , et al. February 1, 2	2005-02-01
Microelectronic package having a compliant layer with bumped protrusions Grant 6,847,101 - Fjelstad , et al. January 25, 2	2005-01-25
Image forming apparatus with improved transfer efficiency Grant 6,847,107 - Fjelstad , et al. January 25, 2	2005-01-25
Methods for manufacturing resistors using a sacrificial layer App 20040233035 - Fjelstad, Joseph	2004-11-25
Method of assembling a semiconductor chip package Grant 6,821,815 - Smith , et al. November 23, 2	2004-11-23
Methods for manufacturing resistors using a sacrificial layer Grant 6,821,821 - Fjelstad November 23, 2	2004-11-23
Microelectronic assemblies having compliant layers App 20040227225 - Fjelstad, Joseph ; et al.	2004-11-18
Methods for manufacturing resistors using a sacrificial layer App 20040194294 - Fjelstad, Joseph	2004-10-07
Compliant package with conductive elastomeric posts App 20040169263 - Fjelstad, Joseph	2004-09-02
Methods for providing void-free layers for semiconductor assemblies Grant 6,780,747 - Distefano , et al. August 24, 2	2004-08-24
Microelectronic unit forming methods and materials Grant 6,737,265 - Beroz , et al. May 18, 2	2004-05-18
Methods and structures for electronic probing arrays App 20040080328 - Fjelstad, Joseph	2004-04-29
Methods of making microelectronic assemblies having conductive elastomeric posts Grant 6,709,899 - Fjelstad March 23, 2	2004-03-23
Electrical connection with inwardly deformable contacts Grant 6,706,973 - DiStefano , et al. March 16, 2	2004-03-16
Electrical connection with inwardly deformable contacts App 20040045159 - DiStefano, Thomas H. ; et al.	2004-03-11
Electrical connection with inwardly deformable contacts Grant 6,700,072 - Distefano , et al. March 2, 2	2004-03-02
Methods and structures for electronic probing arrays Grant 6,690,186 - Fjelstad February 10, 2	2004-02-10
Methods for providing void-free layers for semiconductor assemblies Grant 6,653,172 - DiStefano , et al. November 25, 2	2003-11-25
Method of bonding a semiconductor die without an ESD circuit and a separate ESD circuit to an external lead, and a semiconductor device made thereby App 20030205802 - Segaram, Para Kanagasabai ; et al.	2003-11-06
Compliant package with conductive elastomeric posts Grant 6,635,514 - Fjelstad October 21, 2	2003-10-21
Method of making an electronic contact App 20030192181 - Fjelstad, Joseph ; et al.	2003-10-16
Semiconductor package having light sensitive chips App 20030136968 - Fjelstad, Joseph	2003-07-24
Method of assembling a semiconductor chip package App 20030129789 - Smith, John W. ; et al.	2003-07-10
Methods and structures for electronic probing arrays Grant 6,586,955 - Fjelstad , et al. July 1, 2	2003-07-01
Semiconductor packages having light-sensitive chips Grant 6,583,444 - Fjelstad June 24, 2	2003-06-24
Microelectronic component with rigid interposer Grant 6,573,609 - Fjelstad , et al. June 3, 2	2003-06-03
Microelectronic connector with planar elastomer sockets Grant 6,541,867 - Fjelstad April 1, 2	2003-04-01
Microelectronic unit forming methods and materials App 20030060032 - Beroz, Masud ; et al.	2003-03-27
Method of assembling a semiconductor chip package Grant 6,518,662 - Smith , et al. February 11, 2	2003-02-11
Methods for providing void-free layers for semiconductor assemblies App 20030027373 - DiStefano, Thomas H. ; et al.	2003-02-06
Methods and structures for electronic probing arrays Grant 6,499,216 - Fjelstad December 31, 2	2002-12-31
Microelectronic assemblies having compliant layers App 20020195685 - Fjelstad, Joseph ; et al.	2002-12-26
Electrical connection with inwardly deformable contact App 20020179325 - DiStefano, Thomas H. ; et al.	2002-12-05
Expandable interposer for a microelectronic package and method therefor Grant 6,486,003 - Fjelstad November 26, 2	2002-11-26
Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures App 20020168797 - DiStefano, Thomas H. ; et al.	2002-11-14
Laterally situated stress/strain relieving lead for a semiconductor chip package Grant 6,468,836 - Distefano , et al. October 22, 2	2002-10-22
Microelectronic assemblies having solder-wettable pads and conductive elements Grant 6,465,747 - DiStefano , et al. October 15, 2	2002-10-15
Compliant microelectronic assemblies Grant 6,465,878 - Fjelstad , et al. October 15, 2	2002-10-15
Method for providing void free layer for semiconductor assemblies Grant 6,458,681 - DiStefano , et al. October 1, 2	2002-10-01
Methods of making compliant semiconductor chip packages App 20020115236 - FJELSTAD, JOSEPH ; et al.	2002-08-22
Microelectronic package having a compliant layer with bumped protrusions App 20020100961 - Fjelstad, Joseph ; et al.	2002-08-01
Thermography catheter with flexible circuit temperature sensors App 20020103445 - Rahdert, David A. ; et al.	2002-08-01
Methods for providing void-free layers for semiconductor assemblies App 20020094671 - Distefano, Thomas H. ; et al.	2002-07-18
Connection component with peelable leads App 20020081781 - DiStefano, Thomas H. ; et al.	2002-06-27
Methods of making microelectronic assemblies having conductive elastomeric posts App 20020081777 - Fjelstad, Joseph	2002-06-27
Methods and structures for electronic probing arrays App 20020075016 - Fjelstad, Joseph	2002-06-20
Microelectronic packages having deformed bonded leads and methods therefor App 20020068426 - Fjelstad, Joseph ; et al.	2002-06-06
Microelectronic assemblies having solder-wettable pads and conductive elements App 20020029902 - DiStefano, Thomas H. ; et al.	2002-03-14
Methods for manufacturing resistors using a sacrificial layer App 20020017702 - Fjelstad, Joseph	2002-02-14
Microelectronic contacts with asperities and methods of making same App 20020008966 - Fjelstad, Joseph ; et al.	2002-01-24
Microelectronic unit forming methods and materials App 20020009827 - Beroz, Masud ; et al.	2002-01-24
Methods for manufacturing resistors using a sacrificial layer App 20020009860 - Fjelstad, Joseph	2002-01-24
Methods and structures for electronic probing arrays App 20020000815 - Fjelstad, Joseph ; et al.	2002-01-03
Semiconductor Package Having Light Sensitive Chips App 20020001869 - FJELSTAD, JOSEPH	2002-01-03
Microelectronics component with rigid interposer App 20010048591 - Fjelstad, Joseph ; et al.	2001-12-06
Method for fabricating microelectronic assemblies Grant 6,324,754 - DiStefano , et al. December 4, 2	2001-12-04
Microelectronic assembly with conductive terminals having an exposed surface through a dielectric layer Grant 6,294,830 - Fjelstad September 25, 2	2001-09-25
Method of making compliant microelectronic assemblies Grant 6,284,563 - Fjelstad September 4, 2	2001-09-04
Electrical connections with deformable contacts Grant 6,274,820 - DiStefano , et al. August 14, 2	2001-08-14
Electrical connection with inwardly deformable contacts App 20010011605 - Distefano, Thomas H. ; et al.	2001-08-09
Microelectronic assembly incorporating lead regions defined by GAPS in a sheet App 20010010400 - Smith, John W. ; et al.	2001-08-02
Method for making a connection component for a semiconductor chip package Grant 6,266,872 - Fjelstad July 31, 2	2001-07-31
Microelectronic elements with deformable leads App 20010009305 - Fjelstad, Joseph	2001-07-26
Components with releasable leads and methods of making releasable leads Grant 6,261,863 - Beroz , et al. July 17, 2	2001-07-17
Semiconductor chip package with fan-in leads App 20010007375 - Fjelstad, Joseph ; et al.	2001-07-12
Components with releasable leads and methods of making releasable leads App 20010006253 - Beroz, Masud ; et al.	2001-07-05
Solder ball placement fixtures and methods Grant 6,253,992 - Fjelstad July 3, 2	2001-07-03
Microelectronic assemblies having exposed conductive terminals and methods therefor App 20010005044 - Fjelstad, Joseph	2001-06-28
Electrical connection with inwardly deformable contacts Grant 6,247,228 - Distefano , et al. June 19, 2	2001-06-19
Microelectric lead structures with plural conductors Grant 6,239,384 - Smith , et al. May 29, 2	2001-05-29
Electrical connections with deformable contacts Grant 6,239,386 - DiStefano , et al. May 29, 2	2001-05-29
Method of fabricating a microelectronic assembly using sheets with gaps to define lead regions Grant 6,228,686 - Smith , et al. May 8, 2	2001-05-08
Fabrication of deformable leads of microelectronic elements Grant 6,221,750 - Fjelstad April 24, 2	2001-04-24
Microelectronic component with rigid interposer Grant 6,208,025 - Bellaar , et al. March 27, 2	2001-03-27
Method of making an electronic contact Grant 6,205,660 - Fjelstad , et al. March 27, 2	2001-03-27
Method of assembling a semiconductor chip package Grant 6,204,091 - Smith , et al. March 20, 2	2001-03-20
Microelectronic connector with planar elastomer sockets Grant 6,133,072 - Fjelstad October 17, 2	2000-10-17
Method of encapsulating a microelectronic assembly utilizing a barrier Grant 6,130,116 - Smith , et al. October 10, 2	2000-10-10
Compliant wirebond packages having wire loop Grant 6,107,682 - Fjelstad August 22, 2	2000-08-22
Methods for providing void-free layers for semiconductor assemblies Grant 6,107,123 - Distefano , et al. August 22, 2	2000-08-22
Method for encapsulating a semiconductor package having apertures through a sacrificial layer and contact pads Grant 6,093,584 - Fjelstad July 25, 2	2000-07-25
Flexible connectors for microelectronic elements Grant 6,086,386 - Fjelstad , et al. July 11, 2	2000-07-11
Flexible contact post and post socket and associated methods therefor Grant 6,007,349 - Distefano , et al. December 28, 1	1999-12-28
Microelectronic component with rigid interposer Grant 6,002,168 - Bellaar , et al. December 14, 1	1999-12-14
Methods for manufacturing a semiconductor package having a sacrificial layer Grant 6,001,671 - Fjelstad December 14, 1	1999-12-14
Microelectronic assembly fabrication with terminal formation from a conductive layer Grant 5,989,936 - Smith , et al. November 23, 1	1999-11-23
Process of manufacturing compliant wirebond packages Grant 5,989,939 - Fjelstad November 23, 1	1999-11-23
Low profile socket for microelectronic components and method for making the same Grant 5,983,492 - Fjelstad November 16, 1	1999-11-16
Soldering with resilient contacts Grant 5,980,270 - Fjelstad , et al. November 9, 1	1999-11-09
Methods of making semiconductor assemblies with reinforced peripheral regions Grant 5,966,587 - Karavakis , et al. October 12, 1	1999-10-12
Microelectronic contacts with asperities and methods of making same Grant 5,934,914 - Fjelstad , et al. August 10, 1	1999-08-10
Connection component with releasable leads Grant 5,904,498 - Fjelstad May 18, 1	1999-05-18
Laterally situated stress/strain relieving lead for a semiconductor chip package Grant 5,821,608 - DiStefano , et al. October 13, 1	1998-10-13
Microelectronic connector for engaging bump leads Grant 5,812,378 - Fjelstad , et al. September 22, 1	1998-09-22
Methods of assembling microelectronic assembly with socket for engaging bump leads Grant 5,802,699 - Fjelstad , et al. September 8, 1	1998-09-08
Method of encapsulating a semiconductor package Grant 5,776,796 - Distefano , et al. July 7, 1	1998-07-07
Semiconductor assemblies with reinforced peripheral regions Grant 5,777,379 - Karavakis , et al. July 7, 1	1998-07-07
Connection component with releasable leads Grant 5,763,941 - Fjelstad June 9, 1	1998-06-09
Microelectronic contacts with asperities and methods of making same Grant 5,632,631 - Fjelstad , et al. May 27, 1	1997-05-27
Manufacture of semiconductor connection components with frangible lead sections Grant 5,629,239 - DiStefano , et al. May 13, 1	1997-05-13
Soldering with resilient contacts Grant 5,615,824 - Fjelstad , et al. April 1, 1	1997-04-01
Method for making a flexible lead for a microelectronic device Grant 5,597,470 - Karavakis , et al. January 28, 1	1997-01-28
Method of making multilayer circuit Grant 5,590,460 - DiStefano , et al. January 7, 1	1997-01-07
Irregularly shaped dice Grant D345,182 - Fjelstad March 15, 1	1994-03-15

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