Fister; Julius C.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fister; Julius C..The latest application filed is for "tarnish deterring tin coating".
- Fister; Julius C. - Hamden CT
| Patent | Date |
|---|---|
| Tarnish deterring tin coating Grant 6,905,782 - Laurello , et al. June 14, 2 | 2005-06-14 |
| Tarnish deterring tin coating App 20050025990 - Laurello, Christopher P. ; et al. | 2005-02-03 |
| Water-based adhesive Grant 6,797,764 - Sagiv , et al. September 28, 2 | 2004-09-28 |
| Water-based adhesive App 20020002232 - Sagiv, Efraim ; et al. | 2002-01-03 |
| Tin coated electrical connector Grant 5,916,695 - Fister , et al. June 29, 1 | 1999-06-29 |
| Tin coated electrical connector Grant 5,780,172 - Fister , et al. July 14, 1 | 1998-07-14 |
| Palladium alloys having utility in electrical applications Grant 5,236,789 - Cowie , et al. August 17, 1 | 1993-08-17 |
| Method of making coated electrical connectors Grant 5,141,702 - Guenin , et al. August 25, 1 | 1992-08-25 |
| Palladium alloys having utility in electrical applications Grant 5,139,891 - Cowie , et al. August 18, 1 | 1992-08-18 |
| Lead frame having polymer coated surface portions Grant 5,122,858 - Mahulikar , et al. June 16, 1 | 1992-06-16 |
| Semiconductor bridge (SCB) packaging system Grant 5,113,764 - Mandigo , et al. May 19, 1 | 1992-05-19 |
| Frangible projectile Grant 5,078,054 - Ashok , et al. January 7, 1 | 1992-01-07 |
| Semiconductor bridge (SCB) packaging system Grant 5,029,529 - Mandigo , et al. July 9, 1 | 1991-07-09 |
| Process for improving the electrical conductivity of a copper-nickel-iron alloy Grant 5,017,244 - Sankaranarayanan , et al. May 21, 1 | 1991-05-21 |
| Semiconductor die attach system Grant 4,978,052 - Fister , et al. December 18, 1 | 1990-12-18 |
| Semiconductor die attach system Grant 4,929,516 - Pryor , et al. May 29, 1 | 1990-05-29 |
| Semiconductor die attach system Grant 4,872,047 - Fister , et al. October 3, 1 | 1989-10-03 |
| Copper-iron-nickel composite material for electrical and electronic applications Grant 4,822,693 - Ashok , et al. April 18, 1 | 1989-04-18 |
| Special surfaces for wire bonding Grant 4,767,049 - Butt , et al. August 30, 1 | 1988-08-30 |
| Whisker resistant tin coatings and baths and methods for making such coatings Grant 4,749,626 - Kadija , et al. June 7, 1 | 1988-06-07 |
| Thermode design for tab and method of use Grant 4,736,882 - Winter , et al. April 12, 1 | 1988-04-12 |
| Thermosonic palladium lead wire bonding Grant 4,674,671 - Fister , et al. June 23, 1 | 1987-06-23 |
| Electrical component forming process Grant 4,649,083 - Fister , et al. March 10, 1 | 1987-03-10 |
| Electrical component forming process Grant 4,500,605 - Fister , et al. February 19, 1 | 1985-02-19 |
| Method of forming a composite material having improved bond strength Grant 4,500,028 - Breedis , et al. February 19, 1 | 1985-02-19 |
| Composite copper nickel alloys with improved solderability shelf life Grant 4,441,118 - Fister , et al. April 3, 1 | 1984-04-03 |
| Composite material having improved bond strength Grant 4,429,022 - Breedis , et al. January 31, 1 | 1984-01-31 |
| Method of forming a composite material Grant 4,362,262 - Winter , et al. December 7, 1 | 1982-12-07 |
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