Fishburn; Fred

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fishburn; Fred.The latest application filed is for "semiconductor structures comprising conductive material lining openings in an insulative material".

Company Profile

0.33.34

Fishburn; Fred - Aptos CA
Fishburn; Fred - Morgan Hill CA
Fishburn; Fred - Boise ID US
Fishburn; Fred - Woodbridge VA US
Fishburn; Fred - Manassas VA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
CMOS over array of 3-D DRAM device Grant 11,380,691 - Varghese , et al. July 5, 2	2022-07-05
Multi-semiconductor material vertical memory strings, strings of memory cells having individually biasable channel regions, memory arrays incorporating such strings, and methods of accesssing and forming the same Grant 8,687,426 - Fishburn April 1, 2	2014-04-01
Semiconductor Structures Comprising Conductive Material Lining Openings In An Insulative Material App 20140027913 - McDaniel; Terrence ; et al.	2014-01-30
Methods of forming conductive contacts Grant 8,580,666 - McDaniel , et al. November 12, 2	2013-11-12
Multi-semiconductor Material Vertical Memory Strings, Strings Of Memory Cells Having Individually Biasable Channel Regions, Meory Arrays Incorporating Such Strings, And Methods Of Accesssing And Forming The Same App 20130187214 - Fishburn; Fred	2013-07-25
Multi-semiconductor material vertical memory strings, strings of memory cells having individually biasable channel regions, memory arrays incorporating such strings, and methods of accessing and forming the same Grant 8,395,941 - Fishburn March 12, 2	2013-03-12
Low Resistance Peripheral Local Interconnect Contacts with Selective Wet Strip of Titanium App 20120025385 - McDaniel; Terrence ; et al.	2012-02-02
Multi-semiconductor Material Vertical Memory Strings, Strings Of Memory Cells Having Individually Biasable Channel Regions, Memory Arrays Incorporating Such Strings, And Methods Of Accessing And Forming The Same App 20110280077 - Fishburn; Fred	2011-11-17
Low resistance peripheral local interconnect contacts with selective wet strip of titanium Grant 8,026,542 - McDaniel , et al. September 27, 2	2011-09-27
Methods Of Forming A Plurality Of Capacitors App 20100266962 - Fishburn; Fred	2010-10-21
Methods of forming a plurality of capacitors Grant 7,759,193 - Fishburn July 20, 2	2010-07-20
Methods Of Forming A Plurality Of Capacitors App 20100009512 - Fishburn; Fred	2010-01-14
Low resistance peripheral local interconnect contacts with selective wet strip of titanium Grant 7,605,033 - McDaniel , et al. October 20, 2	2009-10-20
Contact structure Grant 7,569,453 - Fishburn August 4, 2	2009-08-04
Method for forming controlled geometry hardmasks including subresolution elements Grant 7,473,644 - Lane , et al. January 6, 2	2009-01-06
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby Grant 7,329,607 - Chopra , et al. February 12, 2	2008-02-12
Semiconductor device precursor structures to a double-sided capacitor or a contact Grant 7,321,150 - Fishburn , et al. January 22, 2	2008-01-22
Method of forming a double-sided capacitor Grant 7,273,779 - Fishburn , et al. September 25, 2	2007-09-25
Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces Grant 7,271,086 - Tang , et al. September 18, 2	2007-09-18
Method of forming a contact using a sacrificial structure Grant 7,268,039 - Fishburn , et al. September 11, 2	2007-09-11
Method of forming a contact using a sacrificial structure App 20070141777 - Fishburn; Fred ; et al.	2007-06-21
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby Grant 7,220,663 - Chopra , et al. May 22, 2	2007-05-22
Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces App 20070066040 - Tang; Sanh D. ; et al.	2007-03-22
Low temperature nitride used as Cu barrier layer Grant 7,186,642 - Yin , et al. March 6, 2	2007-03-06
Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces App 20070045865 - Tang; Sanh D. ; et al.	2007-03-01
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby Grant 7,176,576 - Chopra , et al. February 13, 2	2007-02-13
Controlled geometry hardmask including subresolution elements App 20070020939 - Lane; Richard H. ; et al.	2007-01-25
Transistor structure having reduced transistor leakage attributes Grant 7,157,324 - Agarwal , et al. January 2, 2	2007-01-02
Low resistance peripheral local interconnect contacts with selective wet strip of titanium App 20060289918 - McDaniel; Terrence ; et al.	2006-12-28
MEMS heat pumps for integrated circuit heat dissipation App 20060236711 - Vaiyapuri; Venkateshwaran ; et al.	2006-10-26
MEMS heat pumps for integrated circuit heat dissipation App 20060236710 - Vaiyapuri; Venkateshwaran ; et al.	2006-10-26
Method Of Forming A Contact Structure Including A Vertical Barrier Structure And Two Barrier Layers App 20060220087 - Fishburn; Fred	2006-10-05
MEMS heat pumps for integrated circuit heat dissipation Grant 7,107,777 - Vaiyapuri , et al. September 19, 2	2006-09-19
Transistor structure having reduced transistor leakage attributes Grant 7,105,899 - Agarwal , et al. September 12, 2	2006-09-12
MEMS heat pumps for integrated circuit heat dissipation App 20060189022 - Vaiyapuri; Venkateshwaran ; et al.	2006-08-24
MEMS heat pumps for integrated circuit heat dissipation Grant 7,084,004 - Vaiyapuri , et al. August 1, 2	2006-08-01
Method of forming a contact structure including a vertical barrier structure and two barrier layers Grant 7,071,055 - Fishburn July 4, 2	2006-07-04
Low temperature nitride used as cu barrier layer App 20060110920 - Yin; Zhiping ; et al.	2006-05-25
Low resistance peripheral local interconnect contacts with selective wet strip of titanium App 20060046398 - McDaniel; Terrence ; et al.	2006-03-02
Low temperature nitride used as Cu barrier layer Grant 6,984,893 - Yin , et al. January 10, 2	2006-01-10
Method for forming controlled geometry hardmasks including subresolution elements and resulting structures App 20060003182 - Lane; Richard H. ; et al.	2006-01-05
Contact structure App 20050287794 - Fishburn, Fred	2005-12-29
Methods of forming a double-sided capacitor or a contact using a sacrificial structure Grant 6,962,846 - Fishburn , et al. November 8, 2	2005-11-08
Methods of forming a double-sided capacitor or a contact using a sacrificial structure and semiconductor device precursor structures to a double-sided capacitor or a contact App 20050208729 - Fishburn, Fred ; et al.	2005-09-22
Semiconductor device precursor structures to a double-sided capacitor or a contact App 20050118760 - Fishburn, Fred ; et al.	2005-06-02
Methods Of Forming A Double-sided Capacitor Or A Contact Using A Sacrificial Structure App 20050106806 - Fishburn, Fred ; et al.	2005-05-19
Transistor structure having reduced transistor leakage attributes App 20050032290 - Agarwal, Vishnu K. ; et al.	2005-02-10
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby App 20050009318 - Chopra, Dinesh ; et al.	2005-01-13
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby App 20040212093 - Chopra, Dinesh ; et al.	2004-10-28
Integrated circuit having a barrier structure Grant 6,787,833 - Fishburn September 7, 2	2004-09-07
Contact structure App 20040140494 - Fishburn, Fred	2004-07-22
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby Grant 6,756,678 - Chopra , et al. June 29, 2	2004-06-29
Method of forming integrated circuitry, method of forming a capacitor, method of forming DRAM integrated circuitry and DRAM integrated category Grant 6,707,088 - Fishburn March 16, 2	2004-03-16
MEMS heat pumps for integrated circuit heat dissipation App 20040031281 - Vaiyapuri, Venkateshwaran ; et al.	2004-02-19
MEMS heat pumps for integrated circuit heat dissipation App 20040031594 - Vaiyapuri, Venkateshwaran ; et al.	2004-02-19
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby App 20040011554 - Chopra, Dinesh ; et al.	2004-01-22
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby Grant 6,613,671 - Chopra , et al. September 2, 2	2003-09-02
Transistor structure having reduced transistor leakage attributes App 20030132428 - Agarwal, Vishnu K. ; et al.	2003-07-17
Low temperature nitride used as cu barrier layer App 20030071358 - Yin, Zhiping ; et al.	2003-04-17
Method of forming integrated circuitry, method of forming a capacitor, method of forming DRAM integrated circuitry, integrated circuitry and DRAM integrated circuitry App 20030022437 - Fishburn, Fred	2003-01-30
MEMS heat pumps for integrated circuit heat dissipation App 20020184907 - Vaiyapuri, Venkateshwaran ; et al.	2002-12-12
Low temperature nitride used as Cu barrier layer Grant 6,492,267 - Yin , et al. December 10, 2	2002-12-10
Method of forming integrated circuitry, method of forming a capacitor and method of forming DRAM integrated circuitry Grant 6,475,855 - Fishburn November 5, 2	2002-11-05
Method of forming a capacitor container electrode and method of patterning a metal layer by selectively silicizing the electrode or metal layer and removing the silicized portion Grant 6,372,574 - Lane , et al. April 16, 2	2002-04-16
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby App 20010030363 - Chopra, Dinesh ; et al.	2001-10-18

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