Fischer; Petra

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fischer; Petra.The latest application filed is for "semiconductor surface smoothing and semiconductor arrangement".

Company Profile

2.7.12

Fischer; Petra - Wernberg AT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor surface smoothing and semiconductor arrangement Grant 11,373,857 - Goller , et al. June 28, 2	2022-06-28
Semiconductor Surface Smoothing And Semiconductor Arrangement App 20200365385 - GOLLER; Bernhard ; et al.	2020-11-19
Method for patterning a power metallization layer, electronic device and method for processing an electronic device Grant 10,461,031 - Fischer , et al. Oc	2019-10-29
Forming recombination centers in a semiconductor device Grant 10,347,491 - Jantscher , et al. July 9, 2	2019-07-09
Method for Patterning a Power Metallization Layer, Electronic Device and Method for Processing an Electronic Device App 20180358299 - Fischer; Petra ; et al.	2018-12-13
Forming Recombination Centers in a Semiconductor Device App 20180182629 - Jantscher; Wolfgang ; et al.	2018-06-28
Intermediate layer for copper structuring and methods of formation thereof Grant 9,773,736 - Joshi , et al. September 26, 2	2017-09-26
Methods for Forming Semiconductor Devices App 20170110331 - Joshi; Ravi Keshav ; et al.	2017-04-20
Intermediate Layer for Copper Structuring and Methods of Formation Thereof App 20160218033 - Joshi; Ravi Keshav ; et al.	2016-07-28
Semiconductor Device Having A Stress-compensated Chip Electrode App 20160126197 - Matoy; Kurt ; et al.	2016-05-05
Methods for processing a semiconductor wafer Grant 9,059,273 - Fischer , et al. June 16, 2	2015-06-16
Methods For Processing A Semiconductor Wafer App 20150064877 - Fischer; Petra ; et al.	2015-03-05
Method Of Separating Semiconductor Die Using Material Modification App 20150044856 - Engelhardt; Manfred ; et al.	2015-02-12
Method of separating semiconductor die using material modification Grant 8,906,782 - Engelhardt , et al. December 9, 2	2014-12-09
Method For Separating A Plurality Of Dies And A Processing Device For Separating A Plurality Of Dies App 20130115757 - Engelhardt; Manfred ; et al.	2013-05-09
Method Of Separating Semiconductor Die Using Material Modification App 20130115755 - Engelhardt; Manfred ; et al.	2013-05-09

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