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Patent applications and USPTO patent grants for Fine Particle Technology Corp..The latest application filed is for "method of fabricating complex microcircuit boards, substrates and microcircuits and the substrates and microcircuits".
Patent | Date |
---|---|
Method of fabricating complex microcircuit boards, substrates and microcircuits and the substrates and microcircuits Grant 4,994,215 - Wiech, Jr. February 19, 1 | 1991-02-19 |
Method of joining green bodies prior to sintering Grant 4,722,824 - Wiech, Jr. February 2, 1 | 1988-02-02 |
Debinderizer for rapidly removing binder from a green body Grant 4,717,340 - Wiech, Jr. January 5, 1 | 1988-01-05 |
Method for rapidly removing binder from a green body Grant 4,661,315 - Wiech, Jr. April 28, 1 | 1987-04-28 |
Method of fabricating complex microcircuit boards, substrates and microcircuits and the substrates and microcircuits Grant 4,562,092 - Wiech, Jr. December 31, 1 | 1985-12-31 |
Method of fabricating complex micro-circuit boards and substrates and substrate Grant 4,531,145 - Wiech, Jr. July 23, 1 | 1985-07-23 |
Substrate cooling Grant 4,519,447 - Wiech, Jr. May 28, 1 | 1985-05-28 |
Formation of narrow conductive paths on a substrate Grant 4,519,877 - Wiech, Jr. May 28, 1 | 1985-05-28 |
SEC | 0000772447 | FINE PARTICLE TECHNOLOGY CORP |
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