Fine Device Co., Ltd.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fine Device Co., Ltd..The latest application filed is for "laser soldering method and apparatus".
- Fine Device Co., Ltd. - Sakai-Gun Fukui-ken JP
| Patent | Date |
|---|---|
| Process for laser welding resinous members, apparatus for the same and laser-welded resinous product Grant 8,038,828 - Terada , et al. October 18, 2 | 2011-10-18 |
| Process for laser welding resinous members, apparatus for the same and laser-welded resinous product Grant 7,510,620 - Terada , et al. March 31, 2 | 2009-03-31 |
| Laser soldering method and apparatus Grant 6,696,668 - Hayakawa February 24, 2 | 2004-02-24 |
| Laser soldering method and apparatus App 20010054637 - Hayakawa, Jun | 2001-12-27 |
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