loadpatents
name:-0.013018131256104
name:-0.00061392784118652
name:-0.00092315673828125
Filoteo; Dario S. Patent Filings

Filoteo; Dario S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Filoteo; Dario S..The latest application filed is for "integrated circuit package system with bonding in via".

Company Profile
0.0.8
  • Filoteo; Dario S. - Singapore SG
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Integrated Circuit Package System With Bonding In Via
App 20080237873 - Shim; Il Kwon ;   et al.
2008-10-02
Integrated Circuit Packaging System With Interposer
App 20080185719 - Cablao; Philip Lyndon ;   et al.
2008-08-07
Direct Via Wire Bonding And Method Of Assembling The Same
App 20080136022 - Filoteo; Dario S. ;   et al.
2008-06-12
Stacked Die Semiconductor Package
App 20080067658 - Cablao; Philip Lyndon R. ;   et al.
2008-03-20
Chip Scale Module Package In Bga Semiconductor Package
App 20080042265 - Merilo; Leo A. ;   et al.
2008-02-21
Quad Flat Package
App 20080036051 - Espiritu; Emmanuel A. ;   et al.
2008-02-14
Integrated Circuit Package-in-package System
App 20080029905 - Merilo; Leo A. ;   et al.
2008-02-07
Integrated Circuit Heat Spreader Stacking System
App 20080012122 - Filoteo; Dario S. ;   et al.
2008-01-17

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