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Patent applications and USPTO patent grants for Filoteo; Dario S..The latest application filed is for "integrated circuit package system with bonding in via".
Patent | Date |
---|---|
Integrated Circuit Package System With Bonding In Via App 20080237873 - Shim; Il Kwon ;   et al. | 2008-10-02 |
Integrated Circuit Packaging System With Interposer App 20080185719 - Cablao; Philip Lyndon ;   et al. | 2008-08-07 |
Direct Via Wire Bonding And Method Of Assembling The Same App 20080136022 - Filoteo; Dario S. ;   et al. | 2008-06-12 |
Stacked Die Semiconductor Package App 20080067658 - Cablao; Philip Lyndon R. ;   et al. | 2008-03-20 |
Chip Scale Module Package In Bga Semiconductor Package App 20080042265 - Merilo; Leo A. ;   et al. | 2008-02-21 |
Quad Flat Package App 20080036051 - Espiritu; Emmanuel A. ;   et al. | 2008-02-14 |
Integrated Circuit Package-in-package System App 20080029905 - Merilo; Leo A. ;   et al. | 2008-02-07 |
Integrated Circuit Heat Spreader Stacking System App 20080012122 - Filoteo; Dario S. ;   et al. | 2008-01-17 |
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