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Method Of Forming A Photodetector App 20110223706 - HILDRETH; JILL C. ;   et al. | 2011-09-15 |
Dual plasma treatment barrier film to reduce low-k damage Grant 7,763,538 - Turner , et al. July 27, 2 | 2010-07-27 |
Semiconductor device with hydrogen barrier and method therefor Grant 7,592,273 - Filipiak , et al. September 22, 2 | 2009-09-22 |
Method of forming an interlayer dielectric Grant 7,442,598 - Grudowski , et al. October 28, 2 | 2008-10-28 |
Semiconductor Device With Hydrogen Barrier And Method Therefor App 20080261407 - Filipiak; Stanley M. ;   et al. | 2008-10-23 |
Method of forming a semiconductor device having a diffusion barrier stack and structure thereof Grant 7,422,979 - Michaelson , et al. September 9, 2 | 2008-09-09 |
Method For Straining A Semiconductor Device App 20070298623 - Spencer; Gregory S. ;   et al. | 2007-12-27 |
Method for forming a stressor structure App 20070224772 - Hall; Mark D. ;   et al. | 2007-09-27 |
Dual plasma treatment barrier film to reduce low-k damage App 20070161229 - Turner; Michael D. ;   et al. | 2007-07-12 |
Method of making a semiconductor device using treated photoresist Grant 7,157,377 - Garza , et al. January 2, 2 | 2007-01-02 |
Method of forming an interlayer dielectric App 20060281240 - Grudowski; Paul A. ;   et al. | 2006-12-14 |
Method of forming a semiconductor device having a diffusion barrier stack and structure thereof App 20060202339 - Michaelson; Lynne M. ;   et al. | 2006-09-14 |
Plasma enhanced nitride layer Grant 7,074,713 - Chen , et al. July 11, 2 | 2006-07-11 |
Plasma enhanced nitride layer App 20060073698 - Chen; Jian ;   et al. | 2006-04-06 |
Method of making a semiconductor device using treated photoresist App 20050181630 - Garza, Cesar M. ;   et al. | 2005-08-18 |
Semiconductor device, memory cell, and processes for forming them Grant 6,686,633 - Lage , et al. February 3, 2 | 2004-02-03 |
Process for forming a combination hardmask and antireflective layer Grant 6,287,951 - Lucas , et al. September 11, 2 | 2001-09-11 |
Method for forming a tensile plasma enhanced nitride capping layer over a gate electrode Grant 6,284,633 - Nagabushnam , et al. September 4, 2 | 2001-09-04 |
Process for forming a semiconductor device having an interconnect or conductive film electrically insulated from a conductive member or region Grant 6,184,073 - Lage , et al. February 6, 2 | 2001-02-06 |
Copper interconnect structure and method of formation Grant 6,174,810 - Islam , et al. January 16, 2 | 2001-01-16 |
Method for forming an inlaid via in a semiconductor device Grant 6,054,377 - Filipiak , et al. April 25, 2 | 2000-04-25 |
Process for forming a semiconductor device with an antireflective layer Grant 5,918,147 - Filipiak , et al. June 29, 1 | 1999-06-29 |
Method for capping copper in semiconductor devices Grant 5,447,887 - Filipiak , et al. September 5, 1 | 1995-09-05 |
Process for forming an intermetallic layer Grant 5,358,901 - Fiordalice , et al. October 25, 1 | 1994-10-25 |
Method for forming a patterned layer using dielectric materials as a light-sensitive material Grant 5,310,626 - Fernandes , et al. May 10, 1 | 1994-05-10 |
Method for forming a nitride layer using preheated ammonia Grant 5,188,979 - Filipiak February 23, 1 | 1993-02-23 |
Process for the selective encapsulation of an electrically conductive structure in a semiconductor device Grant 5,126,283 - Pintchovski , et al. June 30, 1 | 1992-06-30 |