Figura; Paul
Patent Applications and Registrations
Patent applications and USPTO patent grants for Figura; Paul.The latest application filed is for "copper electrodeposition in microelectronics".
- Figura; Paul - Orange CT
- Figura; Paul - Pointe-Claire N/A CA
| Patent | Date |
|---|---|
| Copper electrodeposition in microelectronics Grant RE49,202 - Paneccasio, Jr. , et al. September 6, 2 | 2022-09-06 |
| Copper Electrodeposition in Microelectronics App 20170029972 - Paneccasio, JR.; Vincent ; et al. | 2017-02-02 |
| Copper electrodeposition in microelectronics Grant 9,493,884 - Paneccasio, Jr. , et al. November 15, 2 | 2016-11-15 |
| User touch display interface providing an expanded selection area for a user selectable object Grant 9,092,134 - Figura July 28, 2 | 2015-07-28 |
| Copper Electrodeposition In Microelectronics App 20140102909 - Paneccasio, JR.; Vincent ; et al. | 2014-04-17 |
| Copper electrodeposition in microelectronics Grant 8,608,933 - Paneccasio, Jr. , et al. December 17, 2 | 2013-12-17 |
| Copper Electrodeposition In Microelectronics App 20120043218 - Paneccasio, JR.; Vincent ; et al. | 2012-02-23 |
| Copper electrodeposition in microelectronics Grant 8,002,962 - Paneccasio , et al. August 23, 2 | 2011-08-23 |
| Copper electrodeposition in microelectronics Grant 7,815,786 - Paneccasio, Jr. , et al. October 19, 2 | 2010-10-19 |
| Method and Apparatus for Signaling Neighbor Cell Transmission Frame Allocations App 20090319935 - Figura; Paul | 2009-12-24 |
| Metrology In Electroless Cobalt Plating App 20090155468 - Petrov; Nicolai ; et al. | 2009-06-18 |
| Copper Electrodeposition In Microelectronics App 20070289875 - Paneccasio; Vincent JR. ; et al. | 2007-12-20 |
| Copper electrodeposition in microelectronics Grant 7,303,992 - Paneccasio , et al. December 4, 2 | 2007-12-04 |
| Copper electrodeposition in microelectronics App 20070178697 - Paneccasio; Vincent JR. ; et al. | 2007-08-02 |
| Copper electrodeposition in microelectronics App 20060141784 - Paneccasio; Vincent JR. ; et al. | 2006-06-29 |
| Copper electrodeposition in microelectronics App 20050045488 - Paneccasio, Vincent JR. ; et al. | 2005-03-03 |
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