loadpatents
name:-0.0050888061523438
name:-0.0092859268188477
name:-0.0004270076751709
Fey; Edmond O. Patent Filings

Fey; Edmond O.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fey; Edmond O..The latest application filed is for "printed circuit board with mixed metallurgy pads and method of fabrication".

Company Profile
0.8.3
  • Fey; Edmond O. - Vestal NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of fabricating printed circuit board with mixed metallurgy pads
Grant 6,931,722 - Arrington , et al. August 23, 2
2005-08-23
Accelerated etching of chromium
Grant 6,843,929 - Farquhar , et al. January 18, 2
2005-01-18
Printed circuit board with mixed metallurgy pads and method of fabrication
App 20030177635 - Arrington, Edward L. ;   et al.
2003-09-25
Solder ball with chemically and mechanically enhanced surface properties
Grant 6,607,613 - Egitto , et al. August 19, 2
2003-08-19
Printed circuit board with mixed metallurgy pads and method of fabrication
App 20020157861 - Arrington, Edward L. ;   et al.
2002-10-31
Solder ball with chemically and mechanically enhanced surface properties
App 20010012570 - Egitto, Frank D. ;   et al.
2001-08-09
Methyl chloroform-free desmear process in additive circuitization
Grant 5,311,660 - Alpaugh , et al. May 17, 1
1994-05-17
Electroless plating with bi-level control of dissolved oxygen, with specific location of chemical maintenance means
Grant 4,967,690 - Fey , et al. November 6, 1
1990-11-06
Electroless plating with bi-level control of dissolved oxygen
Grant 4,684,545 - Fey , et al. August 4, 1
1987-08-04
Electrochromic printing
Grant 4,444,626 - Bernier , et al. April 24, 1
1984-04-24
Treatment of copper and use thereof
Grant 4,358,479 - Canestaro , et al. November 9, 1
1982-11-09

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