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Patent applications and USPTO patent grants for Ferrill; Mitchell G..The latest application filed is for "technology for temperature sensitive components in thermal processing".
Patent | Date |
---|---|
Technology for temperature sensitive components in thermal processing Grant 9,563,739 - Ferrill , et al. February 7, 2 | 2017-02-07 |
Technology For Temperature Sensitive Components In Thermal Processing App 20160188786 - Ferrill; Mitchell G. ;   et al. | 2016-06-30 |
Technology for temperature sensitive components in thermal processing Grant 9,317,643 - Ferrill , et al. April 19, 2 | 2016-04-19 |
Technology For Temperature Sensitive Components In Thermal Processing App 20150342056 - Ferrill; Mitchell G. ;   et al. | 2015-11-26 |
Enhanced-reliability printed circuit board for tight-pitch components Grant 8,819,931 - Chamberlin , et al. September 2, 2 | 2014-09-02 |
Interconnect Formation Under Load App 20120300423 - Advocate, JR.; Gerald G. ;   et al. | 2012-11-29 |
Sandwiched organic LGA structure Grant 7,795,724 - Brodsky , et al. September 14, 2 | 2010-09-14 |
Enhanced-reliability printed circuit board for tight-pitch components Grant 7,615,705 - Chamberlin , et al. November 10, 2 | 2009-11-10 |
Sandwiched Organic Lga Structure App 20090057865 - Brodsky; William L. ;   et al. | 2009-03-05 |
Enhanced-reliability Printed Circuit Board For Tight-pitch Components App 20080271314 - Chamberlin; Bruce John ;   et al. | 2008-11-06 |
Enhanced-Reliability Printed Circuit Board for Tight-Pitch Components App 20080014419 - Chamberlin; Bruce John ;   et al. | 2008-01-17 |
Temperature dependent semiconductor module connectors Grant 7,255,571 - Brodsky , et al. August 14, 2 | 2007-08-14 |
Temperature dependent semiconductor module connectors App 20070010111 - Brodsky; William L. ;   et al. | 2007-01-11 |
Temperature dependent semiconductor module connectors Grant 7,137,826 - Brodsky , et al. November 21, 2 | 2006-11-21 |
Hook interconnect Grant 7,128,579 - Brodsky , et al. October 31, 2 | 2006-10-31 |
Temperature Dependent Semiconductor Module Connectors App 20060205273 - Brodsky; William L. ;   et al. | 2006-09-14 |
Thermal/electrical break for printed circuit boards Grant 6,235,994 - Chamberlin , et al. May 22, 2 | 2001-05-22 |
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