Ferguson; Saul

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ferguson; Saul.The latest application filed is for "dielectric oxide films and method for making same".

Company Profile

0.6.11

Ferguson; Saul - Albuquerque NM
Ferguson; Saul - Durham NC
Ferguson; Saul - US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Dielectric Oxide Films and Method for Making Same App 20100311564 - Phillps; Mark ; et al.	2010-12-09
Electrodes, inner layers, capacitors, electronic devices and methods of making thereof Grant 7,741,189 - Borland , et al. June 22, 2	2010-06-22
Power core devices Grant 7,701,052 - Borland , et al. April 20, 2	2010-04-20
Methods for forming process test capacitors for testing embedded passives during embedment into a printed wiring board Grant 7,649,361 - Borland , et al. January 19, 2	2010-01-19
Innerlayer panels and printed wiring boards with embedded fiducials Grant 7,586,198 - Borland , et al. September 8, 2	2009-09-08
Methods for Forming Process Test Capacitors for Testing Embedded Passives During Embedment into a Printed Wiring Board App 20080145995 - Borland; William J. ; et al.	2008-06-19
Power core devices and methods of making thereof App 20070090511 - Borland; William J. ; et al.	2007-04-26
Method of making interlayer panels Grant 7,178,229 - Borland , et al. February 20, 2	2007-02-20
Electrodes, inner layers, capacitors, electronic devices and methods of making thereof App 20060284280 - Borland; William J. ; et al.	2006-12-21
Electrodes, inner layers, capacitors and printed wiring boards and methods of making thereof - part II App 20060282999 - Majumdar; Diptarka ; et al.	2006-12-21
Printed circuit boards having embedded thick film capacitors App 20060254812 - Borland; William J. ; et al.	2006-11-16
Methods of forming printed circuit boards having embedded thick film capacitors Grant 7,100,277 - Borland , et al. September 5, 2	2006-09-05
Method of making innerlayer panels and printed wiring boards using X-ray identification of fiducials App 20060101639 - Borland; William J. ; et al.	2006-05-18
Thick film capacitors, embedding thick-film capacitors inside printed circuit boards, and methods of forming such capacitors and printed circuit boards App 20060002097 - Borland; William J. ; et al.	2006-01-05
Method of making innerlayer panels and printed wiring boards using X-ray identification of fiducials App 20050111206 - Borland, William J. ; et al.	2005-05-26
Printed wiring boards having capacitors and methods of making thereof App 20040231885 - Borland, William J. ; et al.	2004-11-25
Printed wiring boards having low inductance embedded capacitors and methods of making same App 20040108134 - Borland, William J. ; et al.	2004-06-10

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