Ference; Thomas George
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ference; Thomas George.The latest application filed is for "pearl containing cremated remains".
- Ference; Thomas George - Essex Junction VT
| Patent | Date |
|---|---|
| LED light tube Grant 10,088,142 - McGrath , et al. October 2, 2 | 2018-10-02 |
| Pearl containing cremated remains App 20100005835 - Johnson, SR.; Raymond Keith ; et al. | 2010-01-14 |
| Luminescent pop-up candy Grant 7,407,302 - Allard , et al. August 5, 2 | 2008-08-05 |
| Common-path point-diffraction phase-shifting interferometer incorporating a birefringent polymer membrane Grant 7,006,234 - Cottrell , et al. February 28, 2 | 2006-02-28 |
| Luminescent pop-up candy App 20050252384 - Allard, Harvey Clovis ; et al. | 2005-11-17 |
| Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array Grant 6,921,018 - Ference , et al. July 26, 2 | 2005-07-26 |
| Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array Grant 6,858,941 - Ference , et al. February 22, 2 | 2005-02-22 |
| Structures For Increasing The Critical Temperature Of Superconductors App 20040220057 - Ference, Thomas George ; et al. | 2004-11-04 |
| Multi-chip sack and method of fabrication utilizing self-aligning electrical contact array App 20040108364 - Ference, Thomas George ; et al. | 2004-06-10 |
| Chip-on-chip interconnections of varied characterstics Grant 6,642,080 - Ference , et al. November 4, 2 | 2003-11-04 |
| Micro-flex technology in semiconductor packages Grant 6,444,490 - Bertin , et al. September 3, 2 | 2002-09-03 |
| Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array App 20020070438 - Ference, Thomas George ; et al. | 2002-06-13 |
| Micro-flex technology in semiconductor packages App 20010039074 - Bertin, Claude Louis ; et al. | 2001-11-08 |
| Micro-flex technology in semiconductor packages App 20010035529 - Bertin, Claude Louis ; et al. | 2001-11-01 |
| Micro-flex technology in semiconductor packages Grant 6,300,687 - Bertin , et al. October 9, 2 | 2001-10-09 |
| Highly integrated chip-on-chip packaging Grant 6,294,406 - Bertin , et al. September 25, 2 | 2001-09-25 |
| Apparatus and method for vacuum injection molding Grant 6,231,333 - Gruber , et al. May 15, 2 | 2001-05-15 |
| Highly integrated chip-on-chip packaging Grant 5,977,640 - Bertin , et al. November 2, 1 | 1999-11-02 |
| Multiple 3-dimensional semiconductor device processing method and apparatus Grant 5,904,502 - Ference May 18, 1 | 1999-05-18 |
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