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Power source and method of forming same Grant 10,818,811 - Fenner , et al. October 27, 2 | 2020-10-27 |
Power Source And Method Of Forming Same App 20190267503 - FENNER; Andreas A. ;   et al. | 2019-08-29 |
Power source and method of forming same Grant 10,290,757 - Fenner , et al. | 2019-05-14 |
Power Source And Method Of Forming Same App 20170069775 - Fenner; Andreas A. ;   et al. | 2017-03-09 |
Integrated circuit packaging for implantable medical devices Grant 9,496,241 - Askarinya , et al. November 15, 2 | 2016-11-15 |
Power sources suitable for use in implantable medical devices and corresponding fabrication methods Grant 9,252,415 - Askarinya , et al. February 2, 2 | 2016-02-02 |
Integrated Circuit Packaging For Implantable Medical Devices App 20140368266 - Askarinya; Mohsen ;   et al. | 2014-12-18 |
Integrated circuit packaging for implantable medical devices Grant 8,824,161 - Askarinya , et al. September 2, 2 | 2014-09-02 |
Power Sources Suitable For Use In Implantable Medical Devices And Corresponding Fabrication Methods App 20130337313 - Askarinya; Mohsen ;   et al. | 2013-12-19 |
Integrated Circuit Packaging For Implantable Medical Devices App 20130335937 - Askarinya; Mohsen ;   et al. | 2013-12-19 |
Zener triggered overvoltage protection device Grant 7,196,889 - Gerrish , et al. March 27, 2 | 2007-03-27 |
Integrated planar flyback transformer Grant 7,167,074 - Fenner , et al. January 23, 2 | 2007-01-23 |
Single axis accelerometer and method therefore Grant 7,142,921 - Mattes , et al. November 28, 2 | 2006-11-28 |
Integrated planar flyback transformer App 20060152326 - Fenner; Andreas A. ;   et al. | 2006-07-13 |
Single axis accelerometer and method therefore App 20050131482 - Mattes, Michael F. ;   et al. | 2005-06-16 |
High voltage flip-chip component package and method for forming the same Grant 6,836,022 - Boone , et al. December 28, 2 | 2004-12-28 |
Method and apparatus for wafer-level burn-in and testing of integrated circuits Grant 6,806,494 - Fenner , et al. October 19, 2 | 2004-10-19 |
High voltage flip-chip component package and method for forming the same App 20040159956 - Boone, Mark R. ;   et al. | 2004-08-19 |
Zener triggered overvoltage protection device App 20040095698 - Gerrish, Paul F. ;   et al. | 2004-05-20 |
Method and apparatus for wafer-level burn-in and testing of integrated circuits Grant 6,707,065 - Fenner , et al. March 16, 2 | 2004-03-16 |
Method and apparatus for wafer-level burn-in and testing of integrated circuits App 20030205737 - Fenner, Andreas A. ;   et al. | 2003-11-06 |
Method and apparatus for wafer-level burn-in Grant 6,627,917 - Fenner , et al. September 30, 2 | 2003-09-30 |
Method and apparatus for wafer-level burn-in and testing of integrated circuits App 20030010977 - Fenner, Andreas A. ;   et al. | 2003-01-16 |
Method and apparatus for wafer-level burn-in and testing of integrated circuits App 20010033183 - Fenner, Andreas A. ;   et al. | 2001-10-25 |
Feedthrough assembly for implantable medical devices and methods for providing same Grant 6,052,623 - Fenner , et al. April 18, 2 | 2000-04-18 |