Feng; Yu Feng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Feng; Yu Feng.The latest application filed is for "integrated circuit package-in-package system".
- Feng; Yu Feng - Shanghai N/A CN
| Patent | Date |
|---|---|
| Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture therefor Grant 8,946,878 - Chin , et al. February 3, 2 | 2015-02-03 |
| Integrated circuit package system with window opening Grant 8,901,439 - Chin , et al. December 2, 2 | 2014-12-02 |
| Memory device system with stacked packages Grant 8,288,860 - Chin , et al. October 16, 2 | 2012-10-16 |
| Integrated Circuit Package-in-package System App 20090146271 - Chin; Chee Keong ; et al. | 2009-06-11 |
| Memory Device System With Stacked Packages App 20090072378 - Chin; Chee Keong ; et al. | 2009-03-19 |
| Integrated Circuit Package System With Window Opening App 20080041964 - Chin; Chee Keong ; et al. | 2008-02-21 |
| Sawn Integrated Circuit Package System App 20070284139 - Chin; Chee Keong ; et al. | 2007-12-13 |
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