Feng; Yakai
Patent Applications and Registrations
Patent applications and USPTO patent grants for Feng; Yakai.The latest application filed is for "dielectric composite material for fingerprint sensor induction layer and preparation method thereof".
- Feng; Yakai - Tianjin CN
- Feng; Yakai - Teltow N/A DE
- Feng; Yakai - Berlin DE
| Patent | Date |
|---|---|
| Dielectric Composite Material For Fingerprint Sensor Induction Layer And Preparation Method Thereof App 20170121520 - Tan; Xiaohua ; et al. | 2017-05-04 |
| Polymer network with triple shape effect and associated programming method Grant 9,475,269 - Behl , et al. October 25, 2 | 2016-10-25 |
| Polymer Network with Triple Shape Effect and Associated Programming Method App 20150053344 - BEHL; Marc ; et al. | 2015-02-26 |
| Polymer network with triple shape effect and associated programming method Grant 8,901,253 - Behl , et al. December 2, 2 | 2014-12-02 |
| Polymer Network with Triple Shape Effect and Associated Programming Methdo App 20110259517 - Behl; Marc ; et al. | 2011-10-27 |
| Multiblock Copolymers with Shape-Memory Properties App 20100062036 - Kelch; Steffen ; et al. | 2010-03-11 |
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