Feng; Wei-Yi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Feng; Wei-Yi.The latest application filed is for "converter".
- Feng; Wei-Yi - Taoyuan TW
- Feng; Wei-Yi - Shanghai CN
- FENG; Wei-Yi - Taoyuan City TW
- Feng; Wei- Yi - Taipei TW
| Patent | Date |
|---|---|
| Integrated power electronics assembly module Grant 9,961,772 - Feng , et al. May 1, 2 | 2018-05-01 |
| Converter and voltage clamp circuit therein Grant 9,954,429 - Feng , et al. April 24, 2 | 2018-04-24 |
| Converter Grant 9,847,707 - Feng , et al. December 19, 2 | 2017-12-19 |
| Converter App 20170054359 - FENG; Wei-Yi ; et al. | 2017-02-23 |
| Integrated Power Electronics Assembly Module App 20160278211 - FENG; Wei-Yi ; et al. | 2016-09-22 |
| Converter App 20150303828 - FENG; Wei-Yi ; et al. | 2015-10-22 |
| Converter And Voltage Clamp Circuit Therein App 20150303789 - FENG; Wei-Yi ; et al. | 2015-10-22 |
| Method For Preparing Zinc Oxide Nano Rod Substrate App 20100101939 - Ho; Kuo-Chuan ; et al. | 2010-04-29 |
| Method for improving surface plasmon resonance by using conducting metal oxide as adhesive layer Grant 7,671,995 - Lin , et al. March 2, 2 | 2010-03-02 |
| Method For Improving Surface Plasmon Resonance By Using Conducting Metal Oxide As Adhesive Layer App 20090161110 - LIN; CHII-WANN ; et al. | 2009-06-25 |
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