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Patent applications and USPTO patent grants for Feng; Mingang.The latest application filed is for "the clock domain system of interconnected dies and its management methods".
Patent | Date |
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An Inter-Die High-Speed Expansion System And An Expansion Method Thereof App 20220276677 - Wei; Jinghe ;   et al. | 2022-09-01 |
Interface System For Interconnected Die And Mpu And Communication Method Thereof App 20220276304 - Wei; Jinghe ;   et al. | 2022-09-01 |
Data Transmission Event Used For Interconnected Dies App 20220276973 - Wei; Jinghe ;   et al. | 2022-09-01 |
The Clock Domain System of Interconnected Dies and Its Management Methods App 20220276671 - Wei; Jinghe ;   et al. | 2022-09-01 |
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