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Patent applications and USPTO patent grants for Feng; Jen-Nan.The latest application filed is for "modularized wireless earphone".
Patent | Date |
---|---|
Modularized wireless earphone Grant 10,834,492 - Feng , et al. November 10, 2 | 2020-11-10 |
Modularized Wireless Earphone App 20200107105 - FENG; Jen-Nan ;   et al. | 2020-04-02 |
Earphone assembly with moisture resistance Grant 9,451,349 - Wickstrom , et al. September 20, 2 | 2016-09-20 |
Earphone Assembly With Moisture Resistance App 20150304755 - Wickstrom; Timothy K. ;   et al. | 2015-10-22 |
Earphone assembly with moisture resistance Grant 9,078,064 - Wickstrom , et al. July 7, 2 | 2015-07-07 |
Earphone Assembly With Moisture Resistance App 20140010399 - Wickstrom; Timothy K. ;   et al. | 2014-01-09 |
Earphone assembly with moisture resistance Grant 8,532,323 - Wickstrom , et al. September 10, 2 | 2013-09-10 |
High performance microphone and manufacturing method thereof Grant 8,144,898 - Feng March 27, 2 | 2012-03-27 |
Earphone Assembly With Moisture Resistance App 20110182455 - Wickstrom; Timothy K. ;   et al. | 2011-07-28 |
High Performance Microphone and Manufacturing Method Thereof App 20070297636 - Feng; Jen Nan | 2007-12-27 |
High performance microphone and manufacturing method thereof Grant 7,260,230 - Feng August 21, 2 | 2007-08-21 |
Electret condenser microphone and manufacturing method thereof App 20060245606 - Hsieh; Yung Chuan ;   et al. | 2006-11-02 |
High performance capacitor microphone and manufacturing method thereof App 20050089188 - Feng, Jen Nan | 2005-04-28 |
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