Feng; Hsien-Ping

Patent Applications and Registrations

Patent applications and USPTO patent grants for Feng; Hsien-Ping.The latest application filed is for "metal deposition using seed layers".

Company Profile

0.13.16

Feng; Hsien-Ping - Watertown MA
Feng; Hsien-Ping - Youghe TW
Feng; Hsien-Ping - Taipei TW
Feng; Hsien-Ping - Yonghe TW
Feng; Hsien-Ping - Yonghe City TW
Feng; Hsien-Ping - Youghe City TW
Feng; Hsien-Ping - Taipei County TW
Feng; Hsien-Ping - Hsin-Chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metal deposition using seed layers Grant 8,580,100 - Feng , et al. November 12, 2	2013-11-12
Metal deposition using seed layers App 20120217165 - Feng; Hsien-Ping ; et al.	2012-08-30
Apparatus and method for preventing copper peeling in ECP Grant 7,667,835 - Cheng , et al. February 23, 2	2010-02-23
Semiconductor devices having post passivation interconnections and a buffer layer Grant 7,528,478 - Cheng , et al. May 5, 2	2009-05-05
Method and apparatus for stabilizing plating film impurities Grant 7,481,910 - Feng , et al. January 27, 2	2009-01-27
Post ECP multi-step anneal/H.sub.2 treatment to reduce film impurity Grant 7,432,192 - Feng , et al. October 7, 2	2008-10-07
Method of reducing oxygen content in ECP solution App 20080067076 - Cheng; Ming-Yuan ; et al.	2008-03-20
Apparatus and method for preventing copper peeling in ECP App 20080047827 - Cheng; Hsi-Kuei ; et al.	2008-02-28
Method for conductive film quality evaluation Grant 7,262,067 - Feng , et al. August 28, 2	2007-08-28
Method to eliminate plating copper defect Grant 7,256,120 - Tsao , et al. August 14, 2	2007-08-14
Method and apparatus for copper film quality enhancement with two-step deposition Grant 7,189,650 - Liu , et al. March 13, 2	2007-03-13
Systems and methods for wafer cleaning App 20070006405 - Feng; Hsien-Ping ; et al.	2007-01-11
Method for preventing voids in metal interconnects Grant 7,122,471 - Tsao , et al. October 17, 2	2006-10-17
Method for fabricating metal layer App 20060219566 - Cheng; Hsi-Kuei ; et al.	2006-10-05
Post ECP multi-step anneal/H2 treatment to reduce film impurity App 20060216930 - Feng; Hsien-Ping ; et al.	2006-09-28
Metallization target optimization method providing enhanced metallization layer uniformity App 20060196765 - Cheng; Hsi-Kuei ; et al.	2006-09-07
Semiconductor devices having post passivation interconnections with a second connection pattern App 20060145332 - Cheng; Hsi-Kuei ; et al.	2006-07-06
Method to eliminate plating copper defect App 20060141768 - Tsao; Jung-Chin ; et al.	2006-06-29
Method and apparatus for copper film quality enhancement with two-step deposition App 20060105565 - Liu; Chi-Wen ; et al.	2006-05-18
Post ECP multi-step anneal/H2 treatment to reduce film impurity Grant 7,030,016 - Feng , et al. April 18, 2	2006-04-18
Method for reducing defects in post passivation interconnect process Grant 7,026,233 - Cheng , et al. April 11, 2	2006-04-11
Chamber leakage detection by measurement of reflectivity of oxidized thin film Grant 6,985,222 - Cheng , et al. January 10, 2	2006-01-10
Method and apparatus for stabilizing plating film impurities App 20060000717 - Feng; Hsien-Ping ; et al.	2006-01-05
Method for preventing voids in metal interconnects App 20050245064 - Tsao, Jung-Chih ; et al.	2005-11-03
Method for conductive film quality evaluation App 20050239221 - Feng, Hsien-Ping ; et al.	2005-10-27
Post ECP multi-step anneal/H2 treatment to reduce film impurity App 20050227479 - Feng, Hsien-Ping ; et al.	2005-10-13
Method for reducing defects in post passivation interconnect process App 20050032353 - Cheng, Hsi-Kuei ; et al.	2005-02-10
Chamber leakage detection by measurement of reflectivity of oxidized thin film App 20040212798 - Cheng, Hsi-Kuei ; et al.	2004-10-28

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