loadpatents
name:-0.4877450466156
name:-0.25256609916687
name:-0.00059080123901367
Feng; George C. Patent Filings

Feng; George C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Feng; George C..The latest application filed is for "structure and method for forming a dielectric chamber and electronic device including dielectric chamber".

Company Profile
0.10.5
  • Feng; George C. - Poughkeepsie NY
  • Feng; George C. - Wappingers Falls NY
  • Feng; George C. - Essex Junction VT
  • Feng; George C. - Fishkill NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Structure And Method For Forming A Dielectric Chamber And Electronic Device Including Dielectric Chamber
App 20080029841 - Feng; George C. ;   et al.
2008-02-07
Structure and method for forming a dielectric chamber and electronic device including the dielectric chamber
Grant 7,307,011 - Feng , et al. December 11, 2
2007-12-11
Inclusion of low-k dielectric material between bit lines
Grant 7,125,790 - Low , et al. October 24, 2
2006-10-24
Structure and method for forming a dielectric chamber and electronic device including the dielectric chamber
Grant 7,018,916 - Feng , et al. March 28, 2
2006-03-28
Structure and method for forming a dielectric chamber and electronic device including the dielectric chamber
App 20050199977 - Feng, George C. ;   et al.
2005-09-15
Structure and method for forming a dielectric chamber and electronic device including the dielectric chamber
App 20050095837 - Feng, George C. ;   et al.
2005-05-05
Inclusion of low-k dielectric material between bit lines
App 20050085096 - Low, Kia Seng ;   et al.
2005-04-21
Method to improve performance of microelectronic circuits
App 20040038489 - Clevenger, Lawrence A. ;   et al.
2004-02-26
High speed and low cost SDRAM memory subsystem
Grant 5,896,346 - Dell , et al. April 20, 1
1999-04-20
Synchronous memory packaged in single/dual in-line memory module and method of fabrication
Grant 5,513,135 - Dell , et al. April 30, 1
1996-04-30
Multi-layer package incorporating a recessed cavity for a semiconductor chip
Grant 5,081,563 - Feng , et al. January 14, 1
1992-01-14
Two layer resist system
Grant 4,238,559 - Feng , et al. December 9, 1
1980-12-09
Two layer resist system
Grant 4,204,009 - Feng , et al. May 20, 1
1980-05-20
Two layer resist system
Grant 4,180,604 - Feng , et al. December 25, 1
1979-12-25
Method of manufacturing self-aligned semiconductor devices
Grant 4,131,497 - Feng , et al. December 26, 1
1978-12-26

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed