Feng; Duan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Feng; Duan.The latest application filed is for "mems piezoelectric transducer having optimized capacitor shape".

Company Profile

3.4.6

Feng; Duan - Zhuhai CN
Feng; Duan - Shanghai CN
Feng; Duan - Overseas China Town Shenzhen CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Packages with organic back ends for electronic components Grant 11,245,383 - Hurwitz , et al. February 8, 2	2022-02-08
Mems Piezoelectric Transducer Having Optimized Capacitor Shape App 20210367135 - Feng; Duan ; et al.	2021-11-25
Packaged Electronic Components App 20210297054 - Hurwitz; Dror ; et al.	2021-09-23
Packaged electronic components Grant 11,063,571 - Hurwitz , et al. July 13, 2	2021-07-13
Packages with Organic Back Ends for Electronic Components App 20210028766 - Hurwitz; Dror ; et al.	2021-01-28
Packaged Electronic Components App 20210028754 - Hurwitz; Dror ; et al.	2021-01-28
Method for Packaging an Electronic Component in a Package with an Organic Back End App 20210028751 - Hurwitz; Dror ; et al.	2021-01-28
Method of fabricating novel packages for electronic components Grant 10,797,681 - Hurwitz , et al. October 6, 2	2020-10-06
Handheld magnifying device incorporating a circular array of light emitting diodes Grant 7,599,135 - Feng October 6, 2	2009-10-06
Handheld magnifying device incorporating a circular array of light emitting diodes App 20090067066 - Feng; Duan	2009-03-12

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