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Feng; Chieh-Wei Patent Filings

Feng; Chieh-Wei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Feng; Chieh-Wei.The latest application filed is for "capacitor and filter and redistribution layer structure including the same".

Company Profile
9.9.11
  • Feng; Chieh-Wei - Taoyuan TW
  • Feng; Chieh-Wei - Taoyuan City TW
  • Feng; Chieh-Wei - Taoyuan County TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
System in package structure for perform electrostatic discharge operation and electrostatic discharge protection structure thereof
Grant 11,387,230 - Yu , et al. July 12, 2
2022-07-12
Capacitor And Filter And Redistribution Layer Structure Including The Same
App 20220173055 - Ting; Tzu-Yang ;   et al.
2022-06-02
Redistribution structure and forming method thereof
Grant 11,251,115 - Yan , et al. February 15, 2
2022-02-15
Semiconductor Package Structure
App 20220005768 - Yang; Jui-Wen ;   et al.
2022-01-06
Electrostatic discharge protection apparatus and integrated passive device with capacitors
Grant 11,088,135 - Chung , et al. August 10, 2
2021-08-10
Electronic Device
App 20210098558 - Chen; Wei-Chung ;   et al.
2021-04-01
Chip package structure and manufacturing method thereof
Grant 10,950,588 - Yu , et al. March 16, 2
2021-03-16
Panel to be plated, electroplating process using the same, and chip manufactured from the same
Grant 10,941,498 - Chu , et al. March 9, 2
2021-03-09
Swimming posture correction method and swimming posture correction system
Grant 10,786,719 - Ting , et al. September 29, 2
2020-09-29
Swimming Posture Correction Method And Swimming Posture Correction System
App 20200269113 - Ting; Tzu-Yang ;   et al.
2020-08-27
Electrostatic Discharge Protection Apparatus And Integrated Passive Device With Capacitors
App 20200212033 - Chung; Yu-Hua ;   et al.
2020-07-02
Panel To Be Plated, Electroplating Process Using The Same, And Chip Manufactured From The Same
App 20200063282 - CHU; Chien-Hsun ;   et al.
2020-02-27
System In Package Structure And Electrostatic Discharge Protection Structure Thereof
App 20190355713 - Yu; Cheng-Hung ;   et al.
2019-11-21
Chip Package Structure And Manufacturing Method Thereof
App 20190341373 - Yu; Cheng-Hung ;   et al.
2019-11-07
Pixel structure and display panel
Grant 10,418,435 - Wang , et al. Sept
2019-09-17
Flexible Chip Package
App 20190103360 - Yu; Cheng-Hung ;   et al.
2019-04-04
Pixel Structure And Display Panel
App 20190013378 - Wang; Tai-Jui ;   et al.
2019-01-10
Transistor device having protruding portion from channel portion
Grant 9,960,245 - Wang , et al. May 1, 2
2018-05-01
Thin film transistor
Grant 9,397,220 - Huang , et al. July 19, 2
2016-07-19
Thin Film Transistor
App 20150364596 - Huang; Chin-Hai ;   et al.
2015-12-17

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