Fender; Jason R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fender; Jason R..The latest application filed is for "integrated circuits and devices with interleaved transistor elements, and methods of their fabrication".

Company Profile

3.10.12

Fender; Jason R. - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuits and devices with interleaved transistor elements, and methods of their fabrication Grant 10,366,986 - Fender , et al. July 30, 2	2019-07-30
Integrated Circuits And Devices With Interleaved Transistor Elements, And Methods Of Their Fabrication App 20190221561 - Fender; Jason R. ; et al.	2019-07-18
Universal SPI (Serial Peripheral Interface) Grant 10,318,447 - Spence , et al.	2019-06-11
Methods of fabricating integrated circuits and devices with interleaved transistor elements Grant 10,283,500 - Fraser , et al.	2019-05-07
Methods Of Fabricating Integrated Circuits And Devices With Interleaved Transistor Elements App 20180033787 - FRASER; Michael L. ; et al.	2018-02-01
Integrated circuits and devices with interleaved transistor elements, and methods of their fabrication Grant 9,780,090 - Fraser , et al. October 3, 2	2017-10-03
Universal Spi (serial Peripheral Interface) App 20170220519 - Spence; Nicholas J. ; et al.	2017-08-03
Universal SPI (serial peripheral interface) Grant 9,658,971 - Spence , et al. May 23, 2	2017-05-23
Integrated Circuits And Devices With Interleaved Transistor Elements, And Methods Of Their Fabrication App 20170110451 - FRASER; MICHAEL L. ; et al.	2017-04-20
Die fracture detection and humidity protection with double guard ring arrangement Grant 9,070,683 - Fender , et al. June 30, 2	2015-06-30
Universal Spi (serial Peripheral Interface) App 20150074319 - Spence; Nicholas J. ; et al.	2015-03-12
Die Fracture Detection and Humidity Protection with Double Guard Ring Arrangement App 20140375341 - Fender; Jason R. ; et al.	2014-12-25
Integrated passive device with a high resistivity substrate and method for forming the same Grant 7,935,607 - Abrokwah , et al. May 3, 2	2011-05-03
Microelectronic assembly with back side metallization and method for forming the same Grant 7,723,224 - Hill , et al. May 25, 2	2010-05-25
Integrated Passive Device And Method With Low Cost Substrate App 20090236689 - Daly; Terry K. ; et al.	2009-09-24
Integrated Passive Device With A High Resistivity Substrate And Method For Forming The Same App 20080246114 - Abrokwah; Jonathan K. ; et al.	2008-10-09
Microelectronic assembly with back side metallization and method for forming the same App 20070293033 - Hill; Darrell G. ; et al.	2007-12-20
Method for forming solder contacts on mounted substrates App 20070090156 - Ramanathan; Lakshmi N. ; et al.	2007-04-26

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