Feiertag; Gregor

Patent Applications and Registrations

Patent applications and USPTO patent grants for Feiertag; Gregor.The latest application filed is for "multi-mems module".

Company Profile

0.27.19

Feiertag; Gregor - Munchen DE
Feiertag; Gregor - Munich N/A DE
Feiertag; Gregor - Muenchen DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-MEMS module Grant 10,015,600 - Pahl , et al. July 3, 2	2018-07-03
Multi-mems Module App 20160345106 - Pahl; Wolfgang ; et al.	2016-11-24
Sensor module and method for producing sensor modules Grant 9,061,888 - Pahl , et al. June 23, 2	2015-06-23
Miniaturized electrical component comprising an MEMS and an ASIC and production method Grant 9,056,760 - Feiertag , et al. June 16, 2	2015-06-16
Method for encapsulating an MEMS component Grant 9,051,174 - Pahl , et al. June 9, 2	2015-06-09
MEMS microphone and method for producing the MEMS microphone Grant 8,865,499 - Pahl , et al. October 21, 2	2014-10-21
MEMS component, method for producing a MEMS component, and method for handling a MEMS component Grant 8,674,464 - Pahl , et al. March 18, 2	2014-03-18
MEMS package and method for the production thereof Grant 8,674,498 - Feiertag , et al. March 18, 2	2014-03-18
Semiconductor chip arrangement with sensor chip and manufacturing method Grant 8,580,613 - Feiertag , et al. November 12, 2	2013-11-12
MEMS microphone Grant 8,571,239 - Feiertag , et al. October 29, 2	2013-10-29
Arrangement comprising a microphone Grant 8,553,920 - Feiertag , et al. October 8, 2	2013-10-08
MEMS Microphone And Method For Producing The MEMS Microphone App 20130140656 - Pahl; Wolfgang ; et al.	2013-06-06
Miniaturized Electrical Component Comprising an MEMS and an ASIC and Production Method App 20130119492 - Feiertag; Gregor ; et al.	2013-05-16
Method for producing a MEMS package Grant 8,404,516 - Bauer , et al. March 26, 2	2013-03-26
Electrical component and production method Grant 8,294,535 - Feiertag , et al. October 23, 2	2012-10-23
Mems Microphone App 20120093346 - Feiertag; Gregor ; et al.	2012-04-19
Sensor Module And Method For Producing Sensor Modules App 20110298064 - Pahl; Wolfgang ; et al.	2011-12-08
Semiconductor Chip Arrangement With Sensor Chip And Manufacturing Method App 20110233690 - Feiertag; Gregor ; et al.	2011-09-29
Method For Encapsulating An Mems Component App 20110180885 - Pahl; Wolfgang ; et al.	2011-07-28
MEMS Component, Method for Producing a MEMS Component, and Method for Handling a MEMS Component App 20110018076 - Pahl; Wolfgang ; et al.	2011-01-27
Mems Package And Method For The Production Thereof App 20110006381 - Feiertag; Gregor ; et al.	2011-01-13
Arrangement Comprising a Microphone App 20100272302 - Feiertag; Gregor ; et al.	2010-10-28
Method for Producing a MEMS Package App 20100127377 - Bauer; Christian ; et al.	2010-05-27
Electrical component and production method App 20090224851 - Feiertag; Gregor ; et al.	2009-09-10
Method for hermetically encapsulating a component Grant 7,552,532 - Stelzl , et al. June 30, 2	2009-06-30
Method for encapsulating an electrical component, and surface acoustic wave device encapsulated using said method Grant 7,518,201 - Stelzl , et al. April 14, 2	2009-04-14
Encapsulated electronic component and production method Grant 7,388,281 - Krueger , et al. June 17, 2	2008-06-17
Method for encapsulating an electrical component, and surface acoustic wave device encapsulated using said method App 20060249802 - Stelzl; Alois ; et al.	2006-11-09
Method for encapsulating an electrical component Grant 7,094,626 - Stelzl , et al. August 22, 2	2006-08-22
Encapsulated electronic component and production method App 20060151203 - Krueger; Hans ; et al.	2006-07-13
Substrate for an electric component and method for the production thereof Grant 6,909,183 - Feiertag , et al. June 21, 2	2005-06-21
Method for encapsulating an electrical component and surface wave component thus encapsulated App 20040239449 - Stelzl, Alois ; et al.	2004-12-02
Method for hermetically encapsulating a component App 20040237299 - Stelzl, Alois ; et al.	2004-12-02
Substrate for an electric component and method for the production thereof App 20040058473 - Feiertag, Gregor ; et al.	2004-03-25

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