FEI; HUIYANG
Patent Applications and Registrations
Patent applications and USPTO patent grants for FEI; HUIYANG.The latest application filed is for "warpage control for microelectronics packages".
- FEI; HUIYANG - CHANDLER AZ
| Patent | Date |
|---|---|
| Warpage Control For Microelectronics Packages App 20210391281 - LI; ERIC J. ; et al. | 2021-12-16 |
| Warpage control for microelectronics packages Grant 11,114,388 - Li , et al. September 7, 2 | 2021-09-07 |
| Warpage Control For Microelectronics Packages App 20190259713 - LI; ERIC J. ; et al. | 2019-08-22 |
| Warpage control for microelectronics packages Grant 10,256,198 - Li , et al. | 2019-04-09 |
| Methods of forming trenches in packages structures and structures formed thereby Grant 10,231,338 - Yagnamurthy , et al. | 2019-03-12 |
| Warpage Control For Microelectronics Packages App 20180277492 - LI; ERIC J. ; et al. | 2018-09-27 |
| Electronic assembly that includes stacked electronic devices Grant 9,633,937 - Fei , et al. April 25, 2 | 2017-04-25 |
| Methods Of Forming Trenches In Packages Structures And Structures Formed Thereby App 20160381800 - Yagnamurthy; Naga Sivakumar ; et al. | 2016-12-29 |
| Electronic Assembly That Includes Stacked Electronic Devices App 20160225707 - FEI; Huiyang ; et al. | 2016-08-04 |
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