Fehr, Gerald K.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fehr, Gerald K..The latest application filed is for "method for stack-packaging integrated circuit die using at least one die in the package as a spacer".
- Fehr, Gerald K. - La Selva Beach CA
- Fehr; Gerald K. - Cupertino CA
| Patent | Date |
|---|---|
| Method for stack-packaging integrated circuit die using at least one die in the package as a spacer App 20040067606 - Fehr, Gerald K. ; et al. | 2004-04-08 |
| Lead-frame design modification to facilitate removal of resist tape from the lead-frame App 20020089041 - Scherbarth, Michael L. ; et al. | 2002-07-11 |
| Apparatus for encapsulating IC packages with diamond substrate thermal conductor Grant 5,859,477 - Fehr January 12, 1 | 1999-01-12 |
| Method and apparatus for supporting a sensor in a vehicle Grant 5,817,941 - Stalnaker , et al. October 6, 1 | 1998-10-06 |
| Method for forming encapsulated IC packages Grant 5,682,673 - Fehr November 4, 1 | 1997-11-04 |
| Metal semiconductor package with an external plastic seal Grant 5,491,110 - Fehr , et al. February 13, 1 | 1996-02-13 |
| Metal semiconductor package with an external plastic seal Grant 5,436,407 - Fehr , et al. July 25, 1 | 1995-07-25 |
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