Feger; Claudius

Patent Applications and Registrations

Patent applications and USPTO patent grants for Feger; Claudius.The latest application filed is for "operation of diagnostic devices involving microchannels and electrodes".

Company Profile

7.53.49

Feger; Claudius - Poughkeepsie NY
Feger; Claudius - Yorktown Heights NY
Feger; Claudius - Rio de Janeiro BR
FEGER; Claudius - Armonk NY US
Feger; Claudius - Croton-on-Hudson NY
Feger; Claudius - Hopewell Junction NY
FEGER, CLAUDIUS - JUNCTION NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Nanoparticle design for enhanced oil recovery Grant 11,021,646 - Giro , et al. June 1, 2	2021-06-01
Injection-molded solder (IMS) tool assembly and method of use thereof Grant 10,766,086 - Feger , et al. Sep	2020-09-08
Operation Of Diagnostic Devices Involving Microchannels And Electrodes App 20200018723 - Azpiroz; Jaione T. ; et al.	2020-01-16
Nanoparticle Design For Enhanced Oil Recovery App 20190338181 - Giro; Ronaldo ; et al.	2019-11-07
Operation of diagnostic devices involving microchannels and electrodes Grant 10,444,184 - Azpiroz , et al. Oc	2019-10-15
Nanoparticle design for enhanced oil recovery Grant 10,392,555 - Giro , et al. A	2019-08-27
Injection-molded Solder (ims) Tool Assembly And Method Of Use Thereof App 20190160572 - Feger; Claudius ; et al.	2019-05-30
Tunable miniaturized physical subsurface model for simulation and inversion Grant 10,108,762 - Feger , et al. October 23, 2	2018-10-23
Trapping at least one microparticle Grant 10,081,015 - Azpiroz , et al. September 25, 2	2018-09-25
Microchannel, microfluidic chip and method for processing microparticles in a fluid flow Grant 9,962,714 - Azpiroz , et al. May 8, 2	2018-05-08
Method and integrated device for analyzing liquid flow and liquid-solid interface interaction Grant 9,759,643 - Avouris , et al. September 12, 2	2017-09-12
Operation Of Diagnostic Devices Involving Microchannels And Electrodes App 20170184545 - Azpiroz; Jaione T. ; et al.	2017-06-29
Nanoparticle Design For Enhanced Oil Recovery App 20170174978 - Giro; Ronaldo ; et al.	2017-06-22
Microchannel, Microfluidic Chip And Method For Processing Microparticles In A Fluid Flow App 20170008009 - Azpiroz; Jaione Tirapu ; et al.	2017-01-12
Trapping At Least One Microparticle App 20170007996 - Azpiroz; Jaione Tirapu ; et al.	2017-01-12
Method And Integrated Device For Analyzing Liquid Flow And Liquid-solid Interface Interaction App 20160139019 - Avouris; Phaedon ; et al.	2016-05-19
Method and integrated device for analyzing liquid flow and liquid-solid interface interaction Grant 9,310,285 - Avouris , et al. April 12, 2	2016-04-12
Tunable Miniaturized Physical Subsurface Model For Simulation And Inversion App 20160098498 - Feger; Claudius ; et al.	2016-04-07
Method And Integrated Device For Analyzing Liquid Flow And Liquid-solid Interface Interaction App 20160091405 - Avouris; Phaedon ; et al.	2016-03-31
No Flow Underfill Or Wafer Level Underfill And Solder Columns App 20150147846 - FEGER; Claudius ; et al.	2015-05-28
No Flow Underfill Or Wafer Level Underfill And Solder Columns App 20150147851 - Feger; Claudius ; et al.	2015-05-28
No flow underfill or wafer level underfill and solder columns Grant 8,963,340 - Feger , et al. February 24, 2	2015-02-24
Multilayer securing structure and method thereof for the protection of cryptographic keys and code Grant 8,938,627 - Oggioni , et al. January 20, 2	2015-01-20
Forming constant diameter spherical metal balls Grant 8,875,978 - Feger , et al. November 4, 2	2014-11-04
Forming Constant Diameter Spherical Metal Balls App 20140262113 - FEGER; CLAUDIUS ; et al.	2014-09-18
Injection molded solder process for forming solder bumps on substrates Grant 8,820,612 - Feger , et al. September 2, 2	2014-09-02
Vacuum extrusion method of manufacturing a thermal paste Grant 8,636,931 - Feger , et al. January 28, 2	2014-01-28
Injection molded solder process for forming solder bumps on substrates Grant 8,496,159 - Feger , et al. July 30, 2	2013-07-30
Forming constant diameter spherical metal balls Grant 8,408,448 - Feger , et al. April 2, 2	2013-04-02
No Flow Underfill or Wafer Level Underfill and Solder Columns App 20130062757 - Feger; Claudius ; et al.	2013-03-14
Injection Molded Solder Process For Forming Solder Bumps On Substrates App 20120305631 - Feger; Claudius ; et al.	2012-12-06
Injection Molded Solder Process For Forming Solder Bumps On Substrates App 20120305633 - Feger; Claudius ; et al.	2012-12-06
Heat transfer control structures using thermal phonon spectral overlap Grant 8,178,153 - Feger , et al. May 15, 2	2012-05-15
Multilayer Securing Structure And Method Thereof For The Protection Of Cryptographic Keys And Code App 20120117666 - Oggioni; Stefano S. ; et al.	2012-05-10
Reversible thermal thickening grease Grant 7,981,849 - Feger , et al. July 19, 2	2011-07-19
Chip-level underfill method of manufacture Grant 7,951,648 - Feger , et al. May 31, 2	2011-05-31
Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation Grant 7,815,968 - Hougham , et al. October 19, 2	2010-10-19
Underfilling with acid-cleavable acetal and ketal epoxy oligomers Grant 7,776,993 - Buchwalter , et al. August 17, 2	2010-08-17
Method and system for collecting alignment data from coated chips or wafers Grant 7,773,220 - Feger , et al. August 10, 2	2010-08-10
Physically highly secure multi-chip assembly Grant 7,768,005 - Condorelli , et al. August 3, 2	2010-08-03
Chip Carrier Bearing Large Silicon For High Performance Computing And Related Method App 20100164030 - Oggioni; Stefano S. ; et al.	2010-07-01
Chip-level Underfill Process And Structures Thereof App 20100003786 - Feger; Claudius ; et al.	2010-01-07
Method And System For Collecting Alignment Data From Coated Chips Or Wafers App 20090251698 - Feger; Claudius ; et al.	2009-10-08
Assembly Method For Reworkable Chip Stacking With Conductive Film App 20090181476 - Buchwalter; Stephen L. ; et al.	2009-07-16
Wafer-level Underfill Process Using Over-bump-applied Resin App 20090108472 - Feger; Claudius ; et al.	2009-04-30
Solder interconnect structure and method using injection molded solder Grant 7,523,852 - Buchwalter , et al. April 28, 2	2009-04-28
Alignment Marks on the Edge of Wafers and Methods for Same App 20090102070 - Feger; Claudius ; et al.	2009-04-23
Method and apparatus for thermally induced testing of materials under transient temperature Grant 7,516,674 - Feger , et al. April 14, 2	2009-04-14
Apparatus And Methods For Remakeable Connections To Optical Waveguides App 20090080833 - Feger; Claudius ; et al.	2009-03-26
Centrifugal Method For Filing High Aspect Ratio Blind Micro Vias With Powdered Materials For Circuit Formation App 20090032962 - Hougham; Gareth ; et al.	2009-02-05
Vacuum Extrusion Method Of Manufacturing A Thermal Paste App 20080284052 - Feger; Claudius ; et al.	2008-11-20
Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation Grant 7,452,568 - Hougham , et al. November 18, 2	2008-11-18
Marks for the Alignment of Wafer-Level Underfilled Silicon Chips and Method to Produce Same App 20080265445 - Feger; Claudius ; et al.	2008-10-30
Electrical connecting device and method of forming same Grant 7,442,049 - Hougham , et al. October 28, 2	2008-10-28
Physically Highly Secure Multi-chip Assembly App 20080231311 - CONDORELLI; VINCENZO ; et al.	2008-09-25
Reversible Thermal Thickening Grease App 20080220998 - Feger; Claudius ; et al.	2008-09-11
Apparatus and methods for remakeable connections to optical waveguides Grant 7,412,134 - Feger , et al. August 12, 2	2008-08-12
Physically highly secure multi-chip assembly Grant 7,402,442 - Condorelli , et al. July 22, 2	2008-07-22
Heat transfer control structures using thermal phonon spectral overlap App 20070230135 - Feger; Claudius ; et al.	2007-10-04
Physically highly secure multi-chip assembly App 20070138657 - Condorelli; Vincenzo ; et al.	2007-06-21
Apparatus and methods for remakeable connections to optical waveguides App 20070025669 - Feger; Claudius ; et al.	2007-02-01
Electrical connecting device and method of forming same App 20070004239 - Hougham; Gareth Geoffrey ; et al.	2007-01-04
Apparatus and methods for remakeable connections to optical waveguides Grant 7,116,865 - Feger , et al. October 3, 2	2006-10-03
Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation App 20060177568 - Hougham; Gareth ; et al.	2006-08-10
Solder interconnect structure and method using injection molded solder App 20060118604 - Buchwalter; Stephen L. ; et al.	2006-06-08
Reworkable b-stageable adhesive and use in waferlevel underfill App 20050250248 - Buchwalter, Stephen Leslie ; et al.	2005-11-10
Tamper-responding encapsulated enclosure having flexible protective mesh structure Grant 6,929,900 - Farquhar , et al. August 16, 2	2005-08-16
Bilayer wafer-level underfill Grant 6,924,171 - Buchwalter , et al. August 2, 2	2005-08-02
Acid-cleavable acetal and ketal based epoxy oligomers Grant 6,919,420 - Buchwalter , et al. July 19, 2	2005-07-19
Method and system for preventing parallel marketing of wholesale and retail items Grant 6,817,538 - Afzali-Ardakani , et al. November 16, 2	2004-11-16
Tamper-responding encapsulated enclosure having flexible protective mesh structure App 20040195001 - Farquhar, Donald S. ; et al.	2004-10-07
Reworkable b-stageable adhesive and use in waferlevel underfill App 20040110010 - Buchwalter, Stephen Leslie ; et al.	2004-06-10
Apparatus and methods for remakeable connections to optical waveguides App 20040109654 - Feger, Claudius ; et al.	2004-06-10
System for preventing parallel marketing of retail items Grant 6,746,053 - Afzali-Ardakani , et al. June 8, 2	2004-06-08
Low k dielectric materials with inherent copper ion migration barrier Grant 6,730,618 - Cohen , et al. May 4, 2	2004-05-04
Tamper-responding encapsulated enclosure having flexible protective mesh structure Grant 6,686,539 - Farquhar , et al. February 3, 2	2004-02-03
Method for accounting for clamp expansion in a coefficient of thermal expansion measurement Grant 6,672,759 - Feger January 6, 2	2004-01-06
Self compensating design for elastomer interconnects App 20030186572 - Hougham, Gareth Geoffrey ; et al.	2003-10-02
Method and system for preventing parallel marketing of wholesale and retail items App 20020143671 - Afzali-Ardakani, Ali ; et al.	2002-10-03
Increased Accuracy Of Coefficient Of Thermal Expansion Measurement App 20020136262 - FEGER, CLAUDIUS	2002-09-26
Low k dielectric materials with inherent copper ion migration barrier App 20020125549 - Cohen, Stephan Alan ; et al.	2002-09-12
Bilayer wafer-level underfill App 20020109228 - Buchwalter, Stephen L. ; et al.	2002-08-15
Moisture and ion barrier for protection of devices and interconnect structures Grant 6,423,566 - Feger , et al. July 23, 2	2002-07-23
Tamper-responding encapsulated enclosure having flexible protective mesh structure App 20020084090 - Farquhar, Donald S. ; et al.	2002-07-04
Low K Dielectric Materials With Inherent Copper Ion Migration Barrier App 20020033534 - COHEN, STEPHAN ALAN ; et al.	2002-03-21
Efficient backlighting for a portable display Grant 6,217,185 - Feger , et al. April 17, 2	2001-04-17
Portable computer riser for enhanced cooling Grant 6,181,554 - Cipolla , et al. January 30, 2	2001-01-30
Moisture and ion barrier for protection of devices and interconnect structures Grant 6,130,472 - Feger , et al. October 10, 2	2000-10-10
Flat panel display containing black matrix polymer Grant 5,619,357 - Angelopoulos , et al. April 8, 1	1997-04-08
Method of applying flex tape protective coating onto a flex product Grant 5,546,655 - Feger , et al. August 20, 1	1996-08-20
Solid state chain extension polymerization between Lewis acid oligomers and deblocked Lewis bases Grant 5,382,637 - Angelopoulos , et al. January 17, 1	1995-01-17
Flex tape protective coating Grant 5,360,946 - Feger , et al. November 1, 1	1994-11-01
Morphological composite materials formed from different precursors Grant 5,288,842 - Feger , et al. February 22, 1	1994-02-22

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