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name:-0.012832164764404
name:-0.010432004928589
name:-0.00049996376037598
Feeney; Paul M. Patent Filings

Feeney; Paul M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Feeney; Paul M..The latest application filed is for "polishing composition containing polyether amine".

Company Profile
0.10.9
  • Feeney; Paul M. - Aurora IL US
  • Feeney; Paul M. - Richmond VT
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Polishing composition containing polyether amine
Grant 8,741,009 - Dysard , et al. June 3, 2
2014-06-03
Controlled electrochemical polishing method
Grant 7,998,335 - Feeney , et al. August 16, 2
2011-08-16
Composition and method for damascene CMP
Grant 7,837,888 - Feeney , et al. November 23, 2
2010-11-23
Polishing composition containing polyether amine
App 20090289033 - Dysard; Jeffrey M. ;   et al.
2009-11-26
Polishing composition containing polyether amine
Grant 7,585,340 - Dysard , et al. September 8, 2
2009-09-08
CMP of copper/ruthenium/tantalum substrates
App 20080105652 - Brusic; Vlasta ;   et al.
2008-05-08
Polishing composition containing polyether amine
App 20070251155 - Dysard; Jeffrey M. ;   et al.
2007-11-01
Method for controlling polysilicon removal
App 20070077865 - Dysard; Jeffrey M. ;   et al.
2007-04-05
Controlled electrochemical polishing method
App 20060281196 - Feeney; Paul M. ;   et al.
2006-12-14
Method of reducing in-trench smearing during polishing
Grant 6,841,479 - Cherian , et al. January 11, 2
2005-01-11
Preequilibrium polishing method and system
Grant 6,726,534 - Bogush , et al. April 27, 2
2004-04-27
Chemical-mechanical planarization of metallurgy
Grant 6,632,377 - Brusic , et al. October 14, 2
2003-10-14
Method of reducing in-trench smearing during polishing
App 20020151177 - Cherian, Isaac K. ;   et al.
2002-10-17
Use of CsOH in a dielectric CMP slurry
Grant 6,350,393 - Francis , et al. February 26, 2
2002-02-26
Chemical mechanical polishing slurry and method for polishing metal/oxide layers
App 20010052587 - Feeney, Paul M. ;   et al.
2001-12-20
Use Of Csoh In A Dielectric Cmp Slurry
App 20010051433 - Francis, Alicia F. ;   et al.
2001-12-13
Integrated chemical-mechanical polishing
App 20010037821 - Staley, Bradley J. ;   et al.
2001-11-08
Wafer carrier for chemical mechanical polishing
Grant 6,007,411 - Feeney December 28, 1
1999-12-28
Company Registrations
SEC0001197906FEENEY PAUL M

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