Fay; Owen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fay; Owen.The latest application filed is for "interposers for microelectronic devices".
- Fay; Owen - Meridian ID
- Fay; Owen - Gilbert AZ
| Patent | Date |
|---|---|
| Interposers For Microelectronic Devices App 20220254723 - Fay; Owen ; et al. | 2022-08-11 |
| Memory device interface and method Grant 11,386,004 - Keeth , et al. July 12, 2 | 2022-07-12 |
| Interposers for microelectronic devices Grant 11,264,332 - Fay , et al. March 1, 2 | 2022-03-01 |
| Memory Device Interface And Method App 20210318956 - Keeth; Brent ; et al. | 2021-10-14 |
| Memory Device Interface And Method App 20200272564 - Keeth; Brent ; et al. | 2020-08-27 |
| Memory Device Interface And Method App 20200272560 - Keeth; Brent ; et al. | 2020-08-27 |
| Interposers For Microelectronic Devices App 20200168554 - Fay; Owen ; et al. | 2020-05-28 |
| Dry Flux Bonding Device And Method App 20130299868 - Fay; Owen ; et al. | 2013-11-14 |
| Dry flux bonding device and method Grant 8,492,242 - Fay , et al. July 23, 2 | 2013-07-23 |
| Dry Flux Bonding Device And Method App 20110291146 - Fay; Owen ; et al. | 2011-12-01 |
| Method for planarizing vias formed in a substrate App 20070212865 - Amrine; Craig ; et al. | 2007-09-13 |
| Wafer level MEMS packaging Grant 6,953,985 - Lin , et al. October 11, 2 | 2005-10-11 |
| Low cost fabrication and assembly of lid for semiconductor devices Grant 6,949,398 - Lytle , et al. September 27, 2 | 2005-09-27 |
| Under bump metallurgy structural design for high reliability bumped packages Grant 6,930,032 - Sarihan , et al. August 16, 2 | 2005-08-16 |
| Method for eliminating voiding in plated solder Grant 6,780,751 - Fay August 24, 2 | 2004-08-24 |
| Low cost fabrication and assembly of lid for semiconductor devices App 20040087053 - Lytle, William H. ; et al. | 2004-05-06 |
| Method for eliminating voiding in plated solder App 20040072416 - Fay, Owen | 2004-04-15 |
| Wafer level MEMS packaging App 20030230798 - Lin, Jong-Kai ; et al. | 2003-12-18 |
| Under bump metallurgy structural design for high reliability bumped packages App 20030214036 - Sarihan, Vijay ; et al. | 2003-11-20 |
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