Fauty; Joseph K.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Fauty; Joseph K..The latest application filed is for "multi-chip semiconductor connector".
- Fauty; Joseph K. - Mesa AZ
| Patent | Date |
|---|---|
| Electronic package having down-set leads and method Grant 8,319,323 - Letterman, Jr. , et al. November 27, 2 | 2012-11-27 |
| Multi-chip semiconductor connector Grant 8,253,239 - Carney , et al. August 28, 2 | 2012-08-28 |
| Multi-chip Semiconductor Connector App 20110068451 - Carney; Francis J. ; et al. | 2011-03-24 |
| Method of forming a molded array package device having an exposed tab and structure Grant 7,901,990 - Letterman, Jr. , et al. March 8, 2 | 2011-03-08 |
| Multi-chip semiconductor connector and method Grant 7,875,964 - Carney , et al. January 25, 2 | 2011-01-25 |
| Method of forming a leaded molded array package Grant 7,820,528 - Burghout , et al. October 26, 2 | 2010-10-26 |
| Encapsulated chip scale package having flip-chip on lead frame structure Grant 7,656,048 - Fauty , et al. February 2, 2 | 2010-02-02 |
| Method Of Forming A Molded Array Package Device Having An Exposed Tab And Structure App 20100019367 - Letterman, JR.; James P. ; et al. | 2010-01-28 |
| Electronic Package Having Down-set Leads And Method App 20100000772 - Letterman, JR.; James P. ; et al. | 2010-01-07 |
| Method Of Forming A Leaded Molded Array Package App 20090298232 - Burghout; William F. ; et al. | 2009-12-03 |
| Method of forming a molded array package device having an exposed tab and structure Grant 7,602,054 - Letterman, Jr. , et al. October 13, 2 | 2009-10-13 |
| Semiconductor component and method of manufacture Grant 7,598,123 - Yoder , et al. October 6, 2 | 2009-10-06 |
| Method of forming a leaded molded array package Grant 7,588,999 - Burghout , et al. September 15, 2 | 2009-09-15 |
| Multi-chip semiconductor connector assemblies Grant 7,508,060 - Carney , et al. March 24, 2 | 2009-03-24 |
| Multi-chip semiconductor connector assembly method Grant 7,498,195 - Carney , et al. March 3, 2 | 2009-03-03 |
| Encapsulated chip scale package having flip-chip on lead frame structure and method Grant 7,439,100 - Fauty , et al. October 21, 2 | 2008-10-21 |
| Semiconductor Component And Method Of Manufacture App 20080217765 - Yoder; Jay A. ; et al. | 2008-09-11 |
| Encapsulated Chip Scale Package Having Flip-chip On Lead Frame Structure And Method App 20080197459 - Fauty; Joseph K. ; et al. | 2008-08-21 |
| Multi-chip Semiconductor Connector Assemblies App 20080006920 - Carney; Francis J. ; et al. | 2008-01-10 |
| Multi-chip semiconductor connector assemblies Grant 7,298,034 - Carney , et al. November 20, 2 | 2007-11-20 |
| Multi-chip Semiconductor Connector And Method App 20070126106 - Carney; Francis J. ; et al. | 2007-06-07 |
| Multi-chip Semiconductor Connector Assembly Method App 20070126107 - Carney; Francis J. ; et al. | 2007-06-07 |
| Semiconductor component and method of manufacture App 20070117259 - Anderson; Harold G. ; et al. | 2007-05-24 |
| Method of forming a leaded molded array package App 20070111393 - Burghout; William F. ; et al. | 2007-05-17 |
| Multi-chip semiconductor connector assembly method Grant 7,202,105 - Carney , et al. April 10, 2 | 2007-04-10 |
| Multi-chip semiconductor connector and method Grant 7,202,106 - Carney , et al. April 10, 2 | 2007-04-10 |
| Method of forming a molded array package device having an exposed tab and structure App 20070075409 - Letterman; James P. JR. ; et al. | 2007-04-05 |
| Encapsulated chip scale package having flip-chip on lead frame structure and method App 20070040283 - Fauty; Joseph K. ; et al. | 2007-02-22 |
| Method of forming a semiconductor package and leadframe therefor Grant 7,109,064 - Fauty , et al. September 19, 2 | 2006-09-19 |
| Multi-chip semiconductor connector assembly method App 20050287703 - Carney, Francis J. ; et al. | 2005-12-29 |
| Multi-chip semiconductor connector assemblies App 20050285249 - Carney, Francis J. ; et al. | 2005-12-29 |
| Multi-chip semiconductor connector and method App 20050285235 - Carney, Francis J. ; et al. | 2005-12-29 |
| Method of forming a semiconductor package and leadframe therefor App 20050127482 - Fauty, Joseph K. ; et al. | 2005-06-16 |
| Semiconductor device and laminated leadframe package Grant 6,768,186 - Letterman, Jr. , et al. July 27, 2 | 2004-07-27 |
| Semiconductor device and laminated leadframe package App 20040070062 - Letterman, James P. JR. ; et al. | 2004-04-15 |
| Electronic component and method of manufacture Grant 6,164,523 - Fauty , et al. December 26, 2 | 2000-12-26 |
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