Faust; Richard Allen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Faust; Richard Allen.The latest application filed is for "process flow for fabrication of cap metal over top metal with sinter before protective dielectric etch".

Company Profile

1.5.8

Faust; Richard Allen - Dallas TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Process Flow For Fabrication Of Cap Metal Over Top Metal With Sinter Before Protective Dielectric Etch App 20210005560 - Faust; Richard Allen ; et al.	2021-01-07
Surface Conditioning And Material Modification In A Semiconductor Device App 20170345780 - Bashyam; Murlidhar ; et al.	2017-11-30
Multiple depth vias in an integrated circuit Grant 9,455,312 - Liu , et al. September 27, 2	2016-09-27
Multiple Depth Vias In an Integrated Circuit App 20160079343 - LIU; Kaiping ; et al.	2016-03-17
Multiple depth vias in an integrated circuit Grant 9,230,887 - Liu , et al. January 5, 2	2016-01-05
Passivation process to prevent TiW corrosion Grant 9,082,649 - Faust , et al. July 14, 2	2015-07-14
Multiple Depth Vias In An Integrated Circuit App 20150170999 - LIU; Kaiping ; et al.	2015-06-18
Passivation Process To Prevent Tiw Corrosion App 20150145125 - Faust; Richard Allen ; et al.	2015-05-28
Multiple depth vias in an integrated circuit Grant 8,980,723 - Liu , et al. March 17, 2	2015-03-17
Multiple Depth Vias In An Integrated Circuit App 20130334659 - LIU; Kaiping ; et al.	2013-12-19
Semiconductor Device Manufactured Using An Electrochemical Deposition Process For Copper Interconnects App 20080111237 - Leavy; Montray Cantrell ; et al.	2008-05-15
Methods for providing improved layer adhesion in a semiconductor device Grant 6,927,159 - Faust , et al. August 9, 2	2005-08-09
Methods for providing improved layer adhesion in a semiconductor device App 20040241979 - Faust, Richard Allen ; et al.	2004-12-02

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