Fasano; Benjamin V.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Fasano; Benjamin V..The latest application filed is for "integrated circuit structure with optical absorber layer over optical grating coupler".

Company Profile

4.50.36

Fasano; Benjamin V. - New Windsor NY
Fasano; Benjamin V. - Yorktown Heights NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated Circuit Structure With Optical Absorber Layer Over Optical Grating Coupler App 20220057575 - Fasano; Benjamin V. ; et al.	2022-02-24
Integrated circuit structure with optical absorber layer over optical grating coupler Grant 11,204,463 - Fasano , et al. December 21, 2	2021-12-21
Microelectronics Package With Ultra-low-k Dielectric Region Between Stacked Antenna Elements App 20210273323 - Bulumulla; Selaka B. ; et al.	2021-09-02
Microelectronics package with ultra-low-K dielectric region between stacked antenna elements Grant 11,075,453 - Bulumulla , et al. July 27, 2	2021-07-27
Structures And Methods For Aligning And Securing Optical Fibers In Photonic Integrated Circuit (pic) Packages Using Various Adhesives App 20210173145 - Fasano; Benjamin V. ; et al.	2021-06-10
Photonic die fan out package with edge fiber coupling interface and related methods Grant 10,598,860 - Ramachandran , et al.	2020-03-24
Interposer with lattice construction and embedded conductive metal structures Grant 10,460,956 - Audet , et al. Oc	2019-10-29
Photonic Die Fan Out Package With Edge Fiber Coupling Interface And Related Methods App 20190285804 - Ramachandran; Koushik ; et al.	2019-09-19
PIC die packaging using magnetics to position optical element Grant 10,409,014 - Ramachandran , et al. Sept	2019-09-10
Structure for establishing interconnects in packages using thin interposers Grant 10,002,835 - Fasano , et al. June 19, 2	2018-06-19
Validation of mechanical connections Grant 9,947,204 - Benner , et al. April 17, 2	2018-04-17
Selectively Soluble Standoffs For Chip Joining App 20170170148 - Fasano; Benjamin V. ; et al.	2017-06-15
Interposer with lattice construction and embedded conductive metal structures Grant 9,673,064 - Audet , et al. June 6, 2	2017-06-06
Selectively soluble standoffs for chip joining Grant 9,673,177 - Fasano , et al. June 6, 2	2017-06-06
Method And Structure For Establishing Interconnects In Packages Using Thin Interposers App 20170148737 - FASANO; Benjamin V. ; et al.	2017-05-25
Method for establishing interconnects in packages using thin interposers Grant 9,607,973 - Fasano , et al. March 28, 2	2017-03-28
Interposer With Lattice Construction And Embedded Conductive Metal Structures App 20160372337 - Audet; Jean ; et al.	2016-12-22
Interposer with lattice construction and embedded conductive metal structures Grant 9,443,799 - Audet , et al. September 13, 2	2016-09-13
Interposer With Lattice Construction And Embedded Conductive Metal Structures App 20160172290 - Audet; Jean ; et al.	2016-06-16
Interposer With Lattice Construction And Embedded Conductive Metal Structures App 20160172288 - Audet; Jean ; et al.	2016-06-16
Validation Of Mechanical Connections App 20160163176 - Benner; Alan F. ; et al.	2016-06-09
Laser die and photonics die package Grant 9,360,644 - Fasano , et al. June 7, 2	2016-06-07
Laser Die And Photonics Die Package App 20160070061 - Fasano; Benjamin V. ; et al.	2016-03-10
Fill head interface with combination vacuum pressure chamber Grant 9,278,401 - Biggs , et al. March 8, 2	2016-03-08
Validation of mechanical connections Grant 8,981,961 - Benner , et al. March 17, 2	2015-03-17
Flexible Film Carrier To Increase Interconnect Density Of Modules And Methods Thereof App 20150033556 - Fasano; Benjamin V.	2015-02-05
Maintaining laminate flatness using magnetic retention during chip joining Grant 8,940,550 - Fasano , et al. January 27, 2	2015-01-27
Fill Head Interface With Combination Vacuum Pressure Chamber App 20140224860 - Biggs; Glen N. ; et al.	2014-08-14
Validation Of Mechanical Connections App 20140203945 - Benner; Alan F. ; et al.	2014-07-24
Silicon carrier optoelectronic packaging Grant 8,559,474 - Andry , et al. October 15, 2	2013-10-15
Flexible Film Carrier To Increase Interconnect Density Of Modules And Methods Thereof App 20130233598 - Fasano; Benjamin V.	2013-09-12
Silicon Carrier Optoelectronic Packaging App 20120326290 - Andry; Paul S. ; et al.	2012-12-27
Silicon carrier optoelectronic packaging Grant 8,290,008 - Andry , et al. October 16, 2	2012-10-16
Module Assembly Holding Workboard App 20120217986 - Benner; Alan F. ; et al.	2012-08-30
Silicon Carrier Optoelectronic Packaging App 20110044369 - Andry; Paul S. ; et al.	2011-02-24
Structure for implementing secure multichip modules for encryption applications Grant 7,806,341 - Farooq , et al. October 5, 2	2010-10-05
Method to recover underfilled modules by selective removal of discrete components Grant 7,781,232 - Arvin , et al. August 24, 2	2010-08-24
Method and device including reworkable alpha particle barrier and corrosion barrier Grant 7,615,850 - Choudhary , et al. November 10, 2	2009-11-10
Method and apparatus for forming stacked die and substrate structures for increased packing density Grant 7,611,923 - Fasano , et al. November 3, 2	2009-11-03
Method To Recover Underfilled Modules By Selective Removal Of Discrete Components App 20090184407 - Arvin; Charles L. ; et al.	2009-07-23
Structure For Implementing Secure Multichip Modules For Encryption Applications App 20090145973 - Farooq; Mukta G. ; et al.	2009-06-11
Method and structure to provide balanced mechanical loading of devices in compressively loaded environments Grant 7,518,235 - Coico , et al. April 14, 2	2009-04-14
Method and structure for implementing secure multichip modules for encryption applications Grant 7,472,836 - Farooq , et al. January 6, 2	2009-01-06
Method And Device Including Reworkable Alpha Particle Barrier And Corrosion Barrier App 20080217793 - CHOUDHARY; Rehan ; et al.	2008-09-11
Method and device including reworkable alpha particle barrier and corrosion barrier Grant 7,381,590 - Choudhary , et al. June 3, 2	2008-06-03
Method And Structure For Implementing Secure Multichip Modules For Encryption Applications App 20080000988 - Farooq; Mukta G. ; et al.	2008-01-03
Method and structure for implementing secure multichip modules for encryption applications Grant 7,281,667 - Farooq , et al. October 16, 2	2007-10-16
Method And Device Including Reworkable Alpha Particle Barrier And Corrosion Barrier App 20070212820 - Choudhary; Rehan ; et al.	2007-09-13
Method And Apparatus For Forming Stacked Die And Substrate Structures For Increased Packing Density App 20070196953 - Fasano; Benjamin V. ; et al.	2007-08-23
Method and apparatus for forming stacked die and substrate structures for increased packing density Grant 7,250,675 - Fasano , et al. July 31, 2	2007-07-31
Chip package having chip extension and method Grant 7,250,576 - Colgan , et al. July 31, 2	2007-07-31
Method For Preparing And Assembling A Soldered Substrate App 20070158395 - Fasano; Benjamin V. ; et al.	2007-07-12
Chip Package Having Chip Extension And Method App 20060261467 - Colgan; Evan G. ; et al.	2006-11-23
Method And Apparatus For Forming Stacked Die And Substrate Structures For Increased Packing Density App 20060249827 - Fasano; Benjamin V. ; et al.	2006-11-09
Method And Structure For Implementing Secure Multichip Modules For Encryption Applications App 20060231633 - Farooq; Mukta G. ; et al.	2006-10-19
Method And Structure To Provide Balanced Mechanical Loading Of Devices In Compressively Loaded Environments App 20060202325 - Coico; Patrick A. ; et al.	2006-09-14
Method and structure to wire electronic devices Grant 7,088,000 - Cranmer , et al. August 8, 2	2006-08-08
Method to produce low strength temporary solder joints Grant 7,087,513 - Fasano , et al. August 8, 2	2006-08-08
Method And Structure To Wire Electronic Devices App 20060099801 - Cranmer; Michael S. ; et al.	2006-05-11
Method To Produce Low Strength Temporary Solder Joints App 20060088997 - Fasano; Benjamin V. ; et al.	2006-04-27
Stress resistant land grid array (LGA) module and method of forming the same Grant 6,964,885 - Coico , et al. November 15, 2	2005-11-15
Method to produce pedestal features in constrained sintered substrates Grant 6,835,260 - Fasano , et al. December 28, 2	2004-12-28
Stress resistant land grid array (LGA) module and method of forming the same App 20040141296 - Coico, Patrick Anthony ; et al.	2004-07-22
Method to produce pedestal features in constrained sintered substrates App 20040065401 - Fasano, Benjamin V. ; et al.	2004-04-08
Stress resistant land grid array (LGA) module and method of forming the same Grant 6,703,560 - Coico , et al. March 9, 2	2004-03-09
Optical color tracer indentifier in metal paste that bleed to greensheet Grant 6,521,355 - Fasano , et al. February 18, 2	2003-02-18
Method and structure to increase reliability of input/output connections in electrical devices Grant 6,407,927 - Fasano June 18, 2	2002-06-18
Stress resistant land grid array (LGA) module and method of forming the same App 20020050398 - Coico, Patrick Anthony ; et al.	2002-05-02
Land grid array alignment and engagement design Grant 6,354,844 - Coico , et al. March 12, 2	2002-03-12
Method For The Controlling Of Certain Second Phases In Aluminum Nitride App 20010055703 - BATES, RICHARD A. ; et al.	2001-12-27
Multilayer ceramic substrate with anchored pad Grant 6,312,791 - Fasano , et al. November 6, 2	2001-11-06
Compliant high-density land grid array (LGA) connector and method of manufacture Grant 6,224,392 - Fasano , et al. May 1, 2	2001-05-01
Optical color tracer identifier in metal paste that bleed to greensheet Grant 6,194,085 - Fasano , et al. February 27, 2	2001-02-27
Low loss glass ceramic composition with modifiable dielectric constant Grant 6,171,988 - Fasano , et al. January 9, 2	2001-01-09
Method for producing ceramic surfaces with easily removable contact sheets Grant 6,139,666 - Fasano , et al. October 31, 2	2000-10-31
Ceramic substrate having a sealed layer Grant 6,136,419 - Fasano , et al. October 24, 2	2000-10-24
Pastes for improved substrate dimensional control Grant 6,117,367 - Bezama , et al. September 12, 2	2000-09-12
Solid oxide fuel cell having vias and a composite interconnect Grant 6,051,330 - Fasano , et al. April 18, 2	2000-04-18
Method of making a solid oxide fuel cell with controlled porosity Grant 6,051,173 - Fasano , et al. April 18, 2	2000-04-18
Vias and method for making the same in organic board and chip carriers Grant 5,949,030 - Fasano , et al. September 7, 1	1999-09-07
Integrated electronic components having conductive filled through holes Grant 5,872,695 - Fasano , et al. February 16, 1	1999-02-16
Method for in-situ environment sensitive sealing and/or product controlling Grant 5,628,849 - Fasano , et al. May 13, 1	1997-05-13
Aluminum nitride body having graded metallurgy Grant 5,552,232 - Casey , et al. September 3, 1	1996-09-03
Aluminum nitride body having graded metallurgy Grant 5,552,107 - Casey , et al. September 3, 1	1996-09-03

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